Komatsu NTC
A Toyama-based machine tool maker in the Komatsu group that supplies wire saws for slicing silicon and SiC ingots into wafers, including diamond-wire cutting of hard materials.
コマツNTC・Wafer manufacturing equipment・Last updated: October 27, 2026
Overview
Komatsu NTC is a Komatsu group company headquartered in Nanto, Toyama. For wafer manufacturing it supplies multi-wire saws that slice many wafers from an ingot at once.
Its lineup includes saws for silicon ingots and for SiC and other compound materials, where diamond wire is used to cut hard, brittle crystals.
Business: Wire saws for slicing silicon and SiC ingots
Why it matters
- The material lost to the saw kerf is a direct yield loss, which matters most for expensive SiC crystals.
- SiC is much harder than silicon, so slicing is one of the slow and costly steps in SiC wafer production.
Main products
- •Wire saws for silicon ingots
- •Wire saws for SiC and compound semiconductor ingots
Sites in Japan
Head officeHeadquarters
Nanto, Toyama