Hamai Industries
A Tokyo-based maker of lapping and polishing machines used to flatten silicon wafers and other precision substrates.
浜井産業・Wafer manufacturing equipment・Last updated: October 27, 2026
Overview
Hamai Industries is based in Tokyo and specializes in lapping and polishing equipment. Its machines are used in wafer planarization, where both faces of a wafer are processed to a precise thickness and flatness.
Lapping uses loose abrasive between the wafer and a cast iron plate to remove the damage left by slicing and to make both faces parallel. Polishing follows with a soft pad and colloidal slurry. Because both faces of the wafer are processed together, these machines largely determine thickness variation across the wafer.
Business: Lapping and polishing machines for wafers
Why it matters
- Double-side processing removes material from both faces at once, which controls thickness variation better than single-side processing.
- The same lapping technology is used for optical and electronic substrates other than silicon.
Main products
- •Lapping machines
- •Polishing machines
Sites in Japan
Tokyo