Japanese Semiconductor Equipment Products

Tokyo Electron (TEL) (44)

Company profile

• ALPHA-8SE™ i
  Diffusion furnaces
• ANTARES™
  Dry cleaning equipment
• Cellcia™
  Wafer probers
• CELLESTA™-i
  Single-wafer cleaning equipment
• CELLESTA™-i MD
  Single-wafer cleaning equipment
• CELLESTA™ MS2
  Wafer scrubbers
• CELLESTA™ Pro SPM
  Wet resist strip equipment
• CELLESTA™ SCD
  Wafer dryers
• Certas LEAGA™
  Dry cleaning equipment
• CLEAN TRACK™ LITHIUS Pro™
  Coater/developers
• CLEAN TRACK™ LITHIUS Pro™ AP
  Coater/developers
• CLEAN TRACK LITHIUS Pro DICE
  Coater/developers
• CLEAN TRACK™ LITHIUS Pro™ V
  Coater/developers
• CLEAN TRACK LITHIUS Pro Z
  Coater/developers
• Episode™ 1
  CVD equipment
• Episode™ 2 DMR
  CVD equipment
• Episode™ UL
  Etchers by material
• EVAROS™
  Diffusion furnaces
• EXIM™
  PVD equipment
• EXPEDIUS™-i
  Wet etching equipment
• LEXIA™-EX
  PVD equipment
• NS300Z
  Wafer scrubbers
• NT333™
  ALD equipment
• Precio octo™
  Wafer probers
• Precio™ XL
  Wafer probers
• Prexa™
  Wafer probers
• Prexa™ MS
  Wafer probers
• Prexa™ SDP
  Final test equipment
• Synapse™ Si
  CMOS image sensor manufacturing equipment
• Synapse™ V / Synapse™ Z Plus
  TSV formation equipment
• Tactras™
  Dry etching equipment
• TELFORMULA™
  Diffusion furnaces
• TELINDY PLUS
  Diffusion furnaces
• TELINDY PLUS™ IRad™
  ALD equipment
• Triase+™ EX-II™ TiN
  CVD equipment
• Triase+™ SPAi
  Rapid thermal processing (RTP) equipment
• Triase+™ Ti/TiN
  CVD equipment
• Triase+™ W
  CVD equipment
• Ulucus™ G
  Backgrinders
• Ulucus™ L
  Hybrid bonding equipment
• Ulucus™ LX
  Hybrid bonding equipment
• UNITY™ Me+
  SiC power semiconductor equipment
• WDF™ 12DP+
  Wafer probers
• ZETA™+
  Batch wafer cleaning equipment

DISCO (40)

Company profile

• DAD3350
  Dicing saws
• DAD3361
  Dicing saws
• DAD3660
  Dicing saws
• DAG810
  Backgrinders
• DAL7440
  Wire saws and wafer slicing equipment
• DAS8930
  Wafer-level packaging equipment
• DAW4110
  Dicing saws
• DDS2030
  Laser dicing equipment
• DDS2300
  Laser dicing equipment
• DFD6240
  Dicing saws
• DFD6340
  Dicing saws
• DFD6361
  Dicing saws
• DFD6362
  Dicing saws
• DFD6363
  Dicing saws
• DFD6450
  Dicing saws
• DFD6560
  Dicing saws
• DFD6760
  Dicing saws
• DFG8340
  Backgrinders
• DFG8360
  Backgrinders
• DFG8540
  Backgrinders
• DFG8560
  Backgrinders
• DFG8830
  Backgrinders
• DFL7160
  Laser dicing equipment
• DFL7262
  Laser dicing equipment
• DFL7341
  Laser dicing equipment
• DFL7362
  Laser dicing equipment
• DFL7362FH
  Laser dicing equipment
• DFL7560L
  Laser dicing equipment
• DFL7562
  Laser dicing equipment
• DFM2800
  Wafer mounters
• DFP8140
  Wafer polishers (back end)
• DFP8160
  Wafer polishers (back end)
• DFS8960
  Wafer-level packaging equipment
• DGP8761
  Backgrinders
• DGP8762
  Backgrinders
• DIS100
  Final test equipment
• DME8061
  Wafer polishers (back end)
• DMM9200
  Wafer mounters
• NBC-Z series
  Dicing blades and consumables
• ZH05
  Dicing blades and consumables

Advantest (31)

Company profile

• 7038 System-Level Test System
  Final test equipment
• B6700 series
  Burn-in systems
• EVA100
  Analog test systems
• EXAVIS
  Power semiconductor manufacturing equipment
• H5620
  Memory test systems
• HA1200
  Wafer probers
• HA7200
  MEMS manufacturing equipment
• HA7300
  MEMS manufacturing equipment
• M4173
  Test handlers
• M4841
  Test handlers
• M4872
  Test handlers
• M5241
  Test handlers
• M6242
  Test handlers
• MASK CD-SEM E3660
  Mask dimension and flatness metrology
• MASK DR-SEM E5620
  Mask inspection equipment
• MASK MVM-SEM® E3640
  Mask dimension and flatness metrology
• MASK MVM-SEM® E3650
  Mask dimension and flatness metrology
• MT100 / MT200
  Power semiconductor manufacturing equipment
• T2000
  Final test equipment
• T5221
  Memory test systems
• T5230
  Memory test systems
• T5503HS2
  Memory test systems
• T5511
  Memory test systems
• T5801
  Memory test systems
• T5830
  Memory test systems
• T5833
  Memory test systems
• T5835
  Memory test systems
• T5851 / T5851ES
  Memory test systems
• T6391
  Mixed-signal test systems
• V93000 Power and Analog Solutions
  Analog test systems
• V93000 EXA Scale
  Logic test systems

Lasertec (29)

Company profile

• ABICS E120
  Mask inspection equipment
• ABICS E320
  Mask inspection equipment
• ACTIS A150
  Mask inspection equipment
• ACTIS A200HiT series
  Mask inspection equipment
• ACTIS A300 series
  Mask inspection equipment
• BASIC series
  Mask inspection equipment
• BGM300
  TSV formation equipment
• BIM300
  Surface profilers
• CIEL series
  Macro inspection equipment
• CIRIUS series
  Defect inspection equipment
• EZ300
  Macro inspection equipment
• GALOIS211
  Crystal defect inspection equipment
• LX series
  Macro inspection equipment
• MAGICS M5640
  Wafer substrate inspection equipment
• MAGICS M6750 / M6751
  Mask inspection equipment
• MAGICS M9650 / M9651
  Mask inspection equipment
• MAGICS M9750 / M9751
  Mask inspection equipment
• MATRICS X712 series
  Mask inspection equipment
• MATRICS X810EX series
  Mask inspection equipment
• MATRICS X8ULTRA series
  Mask inspection equipment
• MATRICS X9ULTRA series
  Mask inspection equipment
• MPM193 series
  Mask dimension and flatness metrology
• MPM248
  Mask dimension and flatness metrology
• MZ100
  Mask inspection equipment
• OPTELICS® HYBRID+
  Electron microscopes for observation (SEM/TEM)
• PELMIS series
  Mask inspection equipment
• SICA108
  Crystal defect inspection equipment
• SICA88
  Crystal defect inspection equipment
• VIANCA series
  TSV formation equipment

SCREEN Holdings (26)

Company profile

• CW-2000
  Batch wafer cleaning equipment
• DR-8000
  Mask dimension and flatness metrology
• DT-3000 (SOKUDO DUO)
  Coater/developers
• DW-3100
  Laser direct imaging systems
• FC-3100
  Batch wafer cleaning equipment
• FC-821L
  Batch wafer cleaning equipment
• LA-3100
  Laser annealing equipment
• RE-3500
  Ellipsometers
• RF-200EX / RF-300EX
  Coater/developers
• SB-3300
  Wafer scrubbers
• SC-80EX
  Coater/developers
• SK-60EX / SK-80EX
  Coater/developers
• SP-2100
  Wet etching equipment
• SS-3200
  Wafer scrubbers
• SS-3300S
  Wafer scrubbers
• SS-80EX
  Wafer scrubbers
• SU-2000
  Single-wafer cleaning equipment
• SU-3200
  Wet cleaning equipment
• SU-3300
  Wet etching equipment
• SU-3400
  Wet resist strip equipment
• VM-1020
  Film thickness metrology
• VM-1200 / VM-1300
  Film thickness metrology
• VM-2500 / VM-3500
  Film thickness metrology
• WS-620C / WS-820C / WS-820L
  Batch wafer cleaning equipment
• ZI-2000
  Macro inspection equipment
• ZI-3600
  Macro inspection equipment

ULVAC (25)

Company profile

• CC-200
  PECVD equipment
• CCMT-D series
  Vacuum gauges
• CME
  PECVD equipment
• CME-200E
  CVD equipment
• CS
  Sputtering equipment
• ei-5
  Vacuum evaporation equipment
• ei-5 / EVD-600LP
  Vacuum evaporation equipment
• ENTRON-EX W300
  PVD equipment
• ENTRON-EXX
  PVD equipment
• H83 / H84
  Diffusion furnaces
• HELIOT 900 series
  Leak detectors
• IH
  High-energy ion implanters
• IMX-3500
  Medium-current ion implanters
• Luminous NA series
  Ashing equipment
• NE-550EX
  Dry etching equipment
• NLD-570
  MEMS manufacturing equipment
• NLD-5700
  MEMS manufacturing equipment
• RISE-300
  Dry cleaning equipment
• SEGul-200
  Compound semiconductor equipment
• SME
  Sputtering equipment
• SOPHI
  Medium-current ion implanters
• SOPHI-400
  High-energy ion implanters
• SRH
  Sputtering equipment
• uGmni-200C
  PECVD equipment
• uGmni-200E
  Dry etching equipment

Hitachi High-Tech (16)

Company profile

• 9000 series
  Polysilicon etchers
• ArBlade® 5000
  Decapsulation and cross-sectioning equipment
• CG7300
  CD-SEMs
• CR7300
  Review SEMs
• CS5000
  CD-SEMs
• CT1000
  Review SEMs
• CV7300
  CD-SEMs
• DI2800
  Optical wafer inspection equipment
• DI4600
  Wafer inspection equipment
• GT2000
  CD-SEMs
• LS9300AD
  Particle inspection equipment
• M-600 / 6000 series
  Power semiconductor manufacturing equipment
• M-8000 series
  Polysilicon etchers
• NEXTA® STA200
  Thermal analysis instruments (TG-DTA/DSC)
• NanoProber® NP8000
  Failure analysis equipment
• SU7000
  Electron microscopes for observation (SEM/TEM)

Nikon (13)

Company profile

• AMI-5700
  Macro inspection equipment
• DSP-100
  Laser direct imaging systems
• Litho Booster
  Overlay metrology
• NSR-2205iL1
  i-line steppers
• NSR-S215D
  DUV lithography systems
• NSR-S220D
  DUV lithography systems
• NSR-S322F
  DUV lithography systems
• NSR-S333F
  DUV lithography systems
• NSR-S625E
  DUV lithography systems
• NSR-S635E
  DUV lithography systems
• NSR-S636E
  DUV lithography systems
• NSR-SF155
  i-line steppers
• OPTISTATION-3200
  Macro inspection equipment

Canon (11)

Company profile

• FPA-1200NZ2C
  Nanoimprint lithography (NIL)
• FPA-3030EX6
  DUV lithography systems
• FPA-3030i5a
  i-line steppers
• FPA-3030i6
  i-line steppers
• FPA-3030iWa
  i-line steppers
• FPA-5520iV
  Wafer-level packaging equipment
• FPA-5550iX
  i-line steppers
• FPA-5550iZ2
  i-line steppers
• FPA-6300ES6a
  DUV lithography systems
• FPA-6300ESW
  DUV lithography systems
• FPA-8000iW
  Wafer-level packaging equipment

Kokusai Electric (10)

Company profile

• Advanced TSURUGI
  ALD equipment
• Advanced TSURUGI Plus-Ⅲ
  ALD equipment
• AdvancedAce®-II
  LPCVD equipment
• MARORA®
  Rapid thermal processing (RTP) equipment
• QUIXACE®-II
  CVD equipment
• QUIXACE®-LV
  Epitaxial growth equipment
• TANDUO
  Rapid thermal processing (RTP) equipment
• TSURUGI-C²®
  ALD equipment
• VERTEX Revolution
  Oxidation furnaces
• VR300DH3
  Sheet resistance measurement

Ebara (5)

Company profile

• EV-M series
  Vacuum pumps
• F-REX300X
  Metal CMP equipment
• F-REX300XA
  Oxide CMP equipment
• TND-Single (including TND-Single Plus)
  Exhaust gas abatement systems
• UFP600AS
  TSV formation equipment

JEOL (5)

Company profile

• Cross Section Polisher™ IB-19530CP
  Decapsulation and cross-sectioning equipment
• JAMP-9510F
  Surface analysis instruments (XPS/SIMS)
• JBX-3200MVS
  Electron-beam mask writers
• JBX-8100FS
  Electron-beam direct write systems
• JSM-IT810
  Electron microscopes for observation (SEM/TEM)

Tokyo Seimitsu (ACCRETECH) (5)

Company profile

• AD3000T-PLUS
  Dicing saws
• ChaMP211
  Metal CMP equipment
• ChaMP332
  Oxide CMP equipment
• FTB/CCB series hub blades
  Dicing blades and consumables
• UF3000EX-e
  Wafer probers

ESPEC (4)

Company profile

• EHS series HAST chambers (standard type)
  Accelerated life test (HAST) equipment
• Platinous J series
  Temperature and humidity test chambers
• RBC series burn-in chambers
  Burn-in systems
• TSA series thermal shock chambers
  Thermal shock test chambers

Shimadzu (4)

Company profile

• DSC-60 Plus series
  Thermal analysis instruments (TG-DTA/DSC)
• ICPMS-2050
  Contamination analysis equipment
• IRXross
  Organic analysis instruments
• KRATOS ULTRA2 (AXIS Supra+)
  Surface analysis instruments (XPS/SIMS)

Hamamatsu Photonics (3)

Company profile

• Plasma process monitor C10346-01
  Process monitors (EPD/OES)
• Photoionizer L12645
  Ionizers (static elimination)
• PHEMOS-X emission microscope C15765-01
  Failure analysis equipment

HORIBA (3)

Company profile

• CRITERION D500
  Mass flow controllers (MFC)
• LabRAM Odyssey Semiconductor
  Organic analysis instruments
• UVISEL Plus
  Ellipsometers

Koyo Thermo Systems (JTEKT Thermo Systems) (3)

Company profile

• VF-1000H
  Annealing furnaces
• VF-5300H
  Oxidation furnaces
• VF-5700
  LPCVD equipment

Rigaku (3)

Company profile

• Thermo plus EVO2 TG-DTA series
  Thermal analysis instruments (TG-DTA/DSC)
• TXRF 3760
  Surface analysis instruments (XPS/SIMS)
• WaferX 310
  Film composition analysis (XRF/FTIR)

Shinko Electric Industries (3)

Company profile

• DLL® / DLL3® (flip-chip package substrates)
  Package substrates (FC-BGA)
• i-THOP® (substrate for 2.3D packages)
  Interposer assembly equipment
• QFN/QFP and TSOP lead frames
  Lead frames

Sumitomo Heavy Industries Ion Technology (3)

Company profile

• MC3-Ⅱ(MC)
  Medium-current ion implanters
• S-UHE / SS-UHE Ⅱ
  High-energy ion implanters
• SHX-Ⅲ(HC)
  High-current ion implanters

Yokogawa Electric (3)

Company profile

• CELLBrain
  Equipment engineering systems (EES)
• CIMVision-semi
  Manufacturing execution systems (MES)
• EQBrain
  Equipment interfaces (SECS/GEM)

Dai Nippon Printing (DNP) (2)

Company profile

• EUV photomasks (2 nm generation and beyond)
  Photomasks
• QFN lead frames
  Lead frames

Fasford Technology (2)

Company profile

• DB820
  Die bonders
• DB830plus+ series
  Die bonders

Fujikin (2)

Company profile

• FCS®-P8500
  Mass flow controllers (MFC)
• IGS® integrated gas system
  Fluid and gas components (fittings and tubing)

Hugle Electronics (2)

Company profile

• UPC-12500 (SORA) FOUP/FOSB cleaning system
  Carrier cleaning equipment
• IRISYS®-SX
  Ionizers (static elimination)

IWAKI (2)

Company profile

• FS-H series air-driven bellows pumps
  Chemical pumps (bellows pumps)
• FS-N series air-driven bellows pumps
  Chemical pumps (bellows pumps)

Kobelco Research Institute (2)

Company profile

• LTA-2200EP/F
  Carrier lifetime measurement
• SBW series flatness and shape measurement systems
  Wafer substrate inspection equipment

Kusumoto Chemicals (ETAC) (2)

Company profile

• HIFLEX SC (SIMPLICORE)
  Temperature and humidity test chambers
• WINTECH NEO NT550A
  Thermal shock test chambers

LINTEC (2)

Company profile

• Adwill (dicing tapes and BG tapes)
  Dicing and backgrinding tapes
• Adwill RAD-2512F/12
  Wafer mounters

Murata Machinery (Muratec) (2)

Company profile

• CDS350-M3 clean stocker
  Stockers
• CDWX bare wafer stocker
  Stockers

Musashi Engineering (2)

Company profile

• FAD5100S
  Underfill dispensing equipment
• FAD5700
  Dispensers

Napson (2)

Company profile

• NC-80MAP
  Wafer substrate inspection equipment
• RT-3000 / RG-2000
  Sheet resistance measurement

Nissin Ion Equipment (2)

Company profile

• EXCEED3000AH
  Medium-current ion implanters
• IMPHEAT-II
  SiC power semiconductor equipment

Nitta DuPont (2)

Company profile

• IC1000™ series
  Polishing pads and carrier parts
• Suba™ series
  Polishing pads and carrier parts

Otsuka Electronics (2)

Company profile

• FE-300F film thickness monitor
  Process monitors (EPD/OES)
• FE-5000 series
  Ellipsometers

RORZE (2)

Company profile

• ACE SORTER
  Wafer sorters
• RR493 series (vacuum SCARA arm)
  Wafer handling robots

Shibaura Mechatronics (2)

Company profile

• ARTS® (MC-150 series)
  Mask cleaning and drying equipment
• FOC300 series FOSB/FOUP cleaning systems
  Carrier cleaning equipment

SpeedFam (2)

Company profile

• DSM series
  Double-side polishers (DSP)
• EP-300-X
  Wafer edge polishers

Taiyo Nippon Sanso (2)

Company profile

• Cylinder cabinets / BSGS / IGSS
  Gas supply systems and bulk gas equipment
• SR-4000HT
  MOCVD equipment

ULVAC-PHI (2)

Company profile

• PHI GENESIS
  Surface analysis instruments (XPS/SIMS)
• PHI nanoTOF 3+
  Contamination analysis equipment

WINTEST (2)

Company profile

• BI-M series monitor burn-in systems
  Burn-in systems
• WTS-377
  CMOS image sensor manufacturing equipment

Air Water (1)

Company profile

• Mega™ MFⅦ
  Slurry delivery and recovery systems

Anritsu Meter (1)

• AW series thermocouple wafers
  Instrumented wafers

Apic Yamada (1)

• WCM-330
  Molding (encapsulation) equipment

Cambridge Filter Corporation (1)

Company profile

• Absolute Filter GIGA (ULPA) Mini-Pleat GA6
  HEPA and ULPA air filters

CKD (1)

Company profile

• PGM series
  Pressure controllers and flow meters

Daifuku (1)

Company profile

• Clean Stocker CLS-50
  Stockers

ELIONIX (1)

• ELS-BODEN series
  Electron-beam direct write systems

EpiQuest (1)

Company profile

• RC1100
  Molecular beam epitaxy (MBE) equipment

Fujimi Incorporated (1)

• GLANZOX
  Polishing pads and carrier parts

Gigaphoton (1)

Company profile

• GT66A
  Excimer lasers

Hitachi Power Solutions (1)

Company profile

• FineSAT 7
  Scanning acoustic microscopes (SAT)

HOYA (1)

Company profile

• EUV mask blanks
  Photomask blanks

IBIDEN (1)

Company profile

• FC-BGA substrates
  Package substrates (FC-BGA)

Iwasaki Electric (1)

Company profile

• I Ozone Power
  Ozonated water generators

JASCO (1)

• FT/IR-4X
  Organic analysis instruments

JSR (1)

Company profile

• Inpria metal oxide EUV resists
  EUV resists

Kanken Techno (1)

• KT1000 series
  Exhaust gas abatement systems

Kashiyama Industries (1)

Company profile

• NeoDry G series
  Vacuum pumps

KITZ SCT (1)

• NRD series high-pressure diaphragm valves
  Fluid and gas components (fittings and tubing)

Kyocera (1)

Company profile

• FC-BGA substrates
  Package substrates (FC-BGA)

Micronics Japan (1)

Company profile

• U-Probe
  Probe cards

Miraial (1)

• 300mm FOUP
  Wafer carriers, FOUPs and EFEMs

Mitsui Chemicals (1)

Company profile

• ICROS Tape (backgrinding surface protection tape)
  Dicing and backgrinding tapes

Mitsui High-tec (1)

Company profile

• QFN/QFP lead frames (stamped / etched)
  Lead frames

New Cosmos Electric (1)

• PS-8 series
  Gas detection systems

NGK Insulators (1)

• Bonded wafers for SAW filters
  Specialty substrates (sapphire, LT/LN, glass)

Nihon Superior (1)

• SN100C
  Solder materials

Nippon Thompson (IKO) (1)

Company profile

• NanoLinear® NT series
  Precision stages and interferometers

Nitto Denko (1)

Company profile

• ELEP HOLDER (dicing tapes)
  Dicing and backgrinding tapes

NuFlare Technology (1)

• MBM-3000
  Electron-beam mask writers

Okamoto Machine Tool Works (1)

Company profile

• PNX332B
  Wafer polishing and edge grinding equipment

PILLAR (1)

• Super 300 type PILLAR Fitting™
  High-purity piping

Plasma-Therm Japan (1)

• VERSALINE® ICP
  Dry etching equipment

Riken Keiki (1)

Company profile

• SD-3 series (gas detector heads with signal converter)
  Gas detection systems

SAMCO (1)

Company profile

• PC-300 plasma cleaner
  Plasma cleaners for packaging

Senju Metal Industry (1)

• ECO SOLDER M705 (solder balls)
  Assembly materials

Shin-Etsu Polymer (1)

• FOUP300EX
  Wafer carriers, FOUPs and EFEMs

Shishido Electrostatic (1)

Company profile

• BF-X2ME (WINSTAT)
  Ionizers (static elimination)

Showa Shinku (1)

• SEC-22C
  Vacuum evaporation equipment

SPP Technologies (1)

• ASE-Pegasus
  MEMS manufacturing equipment

Sumitomo Heavy Industries (1)

• Marathon® CP
  Cryopumps

Takatori (1)

• MWS-SiC6
  Wire saws and wafer slicing equipment

Tazmo (1)

• New MX2000
  Slurry delivery and recovery systems

TESEC (1)

• 530-IT
  Analog test systems

Tokuyama (1)

Company profile

• 11N polysilicon (semiconductor grade)
  Polysilicon

Toppan (1)

• FC-BGA substrates
  Package substrates (FC-BGA)

Toshiba Electronic Devices & Storage (1)

Company profile

• QuickOnline
  Equipment interfaces (SECS/GEM)

TOWA (1)

Company profile

• CPM1080
  Molding (encapsulation) equipment

TOWA LASERFRONT (1)

• SL473 series wafer markers
  Wafer marking and ID readers

ULVAC Cryogenics (1)

Company profile

• CRYO-U series
  Cryopumps

Ushio (1)

Company profile

• UX-1 series
  Mask aligners

VALQUA (1)

Company profile

• VALQUA ARMOR
  O-rings and seals

Yaskawa Electric (1)

Company profile

• SEMISTAR-GEKKO VD31HDA-C
  Wafer handling robots

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