Japanese Semiconductor Equipment by Category

Front-end equipment

• ALD equipment · 5 products
• Annealing furnaces
  VF-1000H · Koyo Thermo Systems (JTEKT Thermo Systems)
• Ashing equipment
  Luminous NA series · ULVAC
• Batch wafer cleaning equipment · 5 products
• Carrier lifetime measurement
  LTA-2200EP/F · Kobelco Research Institute
• CD-SEMs · 4 products
• Coater/developers · 9 products
• Contamination analysis equipment
  ICPMS-2050 · Shimadzu
  PHI nanoTOF 3+ · ULVAC-PHI
• Crystal defect inspection equipment · 3 products
• CVD equipment · 7 products
• Defect inspection equipment
  CIRIUS series · Lasertec
• Diffusion furnaces · 5 products
• Dry cleaning equipment · 3 products
• Dry etching equipment · 4 products
• DUV lithography systems · 10 products
• Electron-beam direct write systems
  ELS-BODEN series · ELIONIX
  JBX-8100FS · JEOL
• Electron-beam mask writers
  JBX-3200MVS · JEOL
  MBM-3000 · NuFlare Technology
• Ellipsometers · 3 products
• Epitaxial growth equipment
  QUIXACE®-LV · Kokusai Electric
• Etchers by material
  Episode™ UL · Tokyo Electron (TEL)
• Film composition analysis (XRF/FTIR)
  WaferX 310 · Rigaku
• Film thickness metrology · 3 products
• High-current ion implanters
  SHX-Ⅲ(HC) · Sumitomo Heavy Industries Ion Technology
• High-energy ion implanters · 3 products
• i-line steppers · 7 products
• Laser annealing equipment
  LA-3100 · SCREEN Holdings
• Laser direct imaging systems
  DSP-100 · Nikon
  DW-3100 · SCREEN Holdings
• LPCVD equipment
  AdvancedAce®-II · Kokusai Electric
  VF-5700 · Koyo Thermo Systems (JTEKT Thermo Systems)
• Macro inspection equipment · 7 products
• Mask aligners
  UX-1 series · Ushio
• Mask cleaning and drying equipment
  ARTS® (MC-150 series) · Shibaura Mechatronics
• Mask dimension and flatness metrology · 6 products
• Mask inspection equipment · 16 products
• Medium-current ion implanters · 4 products
• Metal CMP equipment
  F-REX300X · Ebara
  ChaMP211 · Tokyo Seimitsu (ACCRETECH)
• MOCVD equipment
  SR-4000HT · Taiyo Nippon Sanso
• Molecular beam epitaxy (MBE) equipment
  RC1100 · EpiQuest
• Nanoimprint lithography (NIL)
  FPA-1200NZ2C · Canon
• Optical wafer inspection equipment
  DI2800 · Hitachi High-Tech
• Overlay metrology
  Litho Booster · Nikon
• Oxidation furnaces
  VERTEX Revolution · Kokusai Electric
  VF-5300H · Koyo Thermo Systems (JTEKT Thermo Systems)
• Oxide CMP equipment
  F-REX300XA · Ebara
  ChaMP332 · Tokyo Seimitsu (ACCRETECH)
• Particle inspection equipment
  LS9300AD · Hitachi High-Tech
• PECVD equipment · 3 products
• Polysilicon etchers
  9000 series · Hitachi High-Tech
  M-8000 series · Hitachi High-Tech
• PVD equipment · 4 products
• Rapid thermal processing (RTP) equipment · 3 products
• Review SEMs
  CR7300 · Hitachi High-Tech
  CT1000 · Hitachi High-Tech
• Sheet resistance measurement
  VR300DH3 · Kokusai Electric
  RT-3000 / RG-2000 · Napson
• Single-wafer cleaning equipment · 3 products
• Slurry delivery and recovery systems
  Mega™ MFⅦ · Air Water
  New MX2000 · Tazmo
• Sputtering equipment · 3 products
• Surface profilers
  BIM300 · Lasertec
• Vacuum evaporation equipment · 3 products
• Wafer dryers
  CELLESTA™ SCD · Tokyo Electron (TEL)
• Wafer inspection equipment
  DI4600 · Hitachi High-Tech
• Wafer scrubbers · 6 products
• Wet cleaning equipment
  SU-3200 · SCREEN Holdings
• Wet etching equipment · 3 products
• Wet resist strip equipment
  SU-3400 · SCREEN Holdings
  CELLESTA™ Pro SPM · Tokyo Electron (TEL)

Back-end equipment

• Accelerated life test (HAST) equipment
  EHS series HAST chambers (standard type) · ESPEC
• Analog test systems · 3 products
• Backgrinders · 9 products
• Burn-in systems · 3 products
• Decapsulation and cross-sectioning equipment
  ArBlade® 5000 · Hitachi High-Tech
  Cross Section Polisher™ IB-19530CP · JEOL
• Dicing saws · 13 products
• Die bonders
  DB820 · Fasford Technology
  DB830plus+ series · Fasford Technology
• Electron microscopes for observation (SEM/TEM) · 3 products
• Failure analysis equipment
  PHEMOS-X emission microscope C15765-01 · Hamamatsu Photonics
  NanoProber® NP8000 · Hitachi High-Tech
• Final test equipment · 4 products
• Hybrid bonding equipment
  Ulucus™ L · Tokyo Electron (TEL)
  Ulucus™ LX · Tokyo Electron (TEL)
• Interposer assembly equipment
  i-THOP® (substrate for 2.3D packages) · Shinko Electric Industries
• Laser dicing equipment · 9 products
• Logic test systems
  V93000 EXA Scale · Advantest
• Memory test systems · 10 products
• Mixed-signal test systems
  T6391 · Advantest
• Molding (encapsulation) equipment
  WCM-330 · Apic Yamada
  CPM1080 · TOWA
• Organic analysis instruments · 3 products
• Plasma cleaners for packaging
  PC-300 plasma cleaner · SAMCO
• Scanning acoustic microscopes (SAT)
  FineSAT 7 · Hitachi Power Solutions
• Surface analysis instruments (XPS/SIMS) · 4 products
• Temperature and humidity test chambers
  Platinous J series · ESPEC
  HIFLEX SC (SIMPLICORE) · Kusumoto Chemicals (ETAC)
• Test handlers · 5 products
• Thermal analysis instruments (TG-DTA/DSC) · 3 products
• Thermal shock test chambers
  TSA series thermal shock chambers · ESPEC
  WINTECH NEO NT550A · Kusumoto Chemicals (ETAC)
• TSV formation equipment · 4 products
• Underfill dispensing equipment
  FAD5100S · Musashi Engineering
• Wafer mounters · 3 products
• Wafer polishers (back end) · 3 products
• Wafer probers · 8 products
• Wafer-level packaging equipment · 4 products

Wafer manufacturing equipment

• Double-side polishers (DSP)
  DSM series · SpeedFam
• Wafer edge polishers
  EP-300-X · SpeedFam
• Wafer polishing and edge grinding equipment
  PNX332B · Okamoto Machine Tool Works
• Wafer substrate inspection equipment · 3 products
• Wire saws and wafer slicing equipment
  DAL7440 · DISCO
  MWS-SiC6 · Takatori

Equipment by device type

• CMOS image sensor manufacturing equipment
  Synapse™ Si · Tokyo Electron (TEL)
  WTS-377 · WINTEST
• Compound semiconductor equipment
  SEGul-200 · ULVAC
• MEMS manufacturing equipment · 5 products
• Power semiconductor manufacturing equipment · 3 products
• SiC power semiconductor equipment
  IMPHEAT-II · Nissin Ion Equipment
  UNITY™ Me+ · Tokyo Electron (TEL)

Equipment components and subsystems

• Carrier cleaning equipment
  UPC-12500 (SORA) FOUP/FOSB cleaning system · Hugle Electronics
  FOC300 series FOSB/FOUP cleaning systems · Shibaura Mechatronics
• Chemical pumps (bellows pumps)
  FS-H series air-driven bellows pumps · IWAKI
  FS-N series air-driven bellows pumps · IWAKI
• Cryopumps
  Marathon® CP · Sumitomo Heavy Industries
  CRYO-U series · ULVAC Cryogenics
• Dicing blades and consumables · 3 products
• Dispensers
  FAD5700 · Musashi Engineering
• Excimer lasers
  GT66A · Gigaphoton
• Fluid and gas components (fittings and tubing)
  IGS® integrated gas system · Fujikin
  NRD series high-pressure diaphragm valves · KITZ SCT
• Instrumented wafers
  AW series thermocouple wafers · Anritsu Meter
• Leak detectors
  HELIOT 900 series · ULVAC
• Mass flow controllers (MFC)
  FCS®-P8500 · Fujikin
  CRITERION D500 · HORIBA
• O-rings and seals
  VALQUA ARMOR · VALQUA
• Ozonated water generators
  I Ozone Power · Iwasaki Electric
• Polishing pads and carrier parts · 3 products
• Precision stages and interferometers
  NanoLinear® NT series · Nippon Thompson (IKO)
• Pressure controllers and flow meters
  PGM series · CKD
• Probe cards
  U-Probe · Micronics Japan
• Process monitors (EPD/OES)
  Plasma process monitor C10346-01 · Hamamatsu Photonics
  FE-300F film thickness monitor · Otsuka Electronics
• Vacuum gauges
  CCMT-D series · ULVAC
• Vacuum pumps
  EV-M series · Ebara
  NeoDry G series · Kashiyama Industries
• Wafer carriers, FOUPs and EFEMs
  300mm FOUP · Miraial
  FOUP300EX · Shin-Etsu Polymer
• Wafer handling robots
  RR493 series (vacuum SCARA arm) · RORZE
  SEMISTAR-GEKKO VD31HDA-C · Yaskawa Electric

Fab infrastructure

• Exhaust gas abatement systems
  TND-Single (including TND-Single Plus) · Ebara
  KT1000 series · Kanken Techno
• Gas detection systems
  PS-8 series · New Cosmos Electric
  SD-3 series (gas detector heads with signal converter) · Riken Keiki
• Gas supply systems and bulk gas equipment
  Cylinder cabinets / BSGS / IGSS · Taiyo Nippon Sanso
• HEPA and ULPA air filters
  Absolute Filter GIGA (ULPA) Mini-Pleat GA6 · Cambridge Filter Corporation
• High-purity piping
  Super 300 type PILLAR Fitting™ · PILLAR
• Ionizers (static elimination) · 3 products

Factory automation

• Equipment engineering systems (EES)
  CELLBrain · Yokogawa Electric
• Equipment interfaces (SECS/GEM)
  QuickOnline · Toshiba Electronic Devices & Storage
  EQBrain · Yokogawa Electric
• Manufacturing execution systems (MES)
  CIMVision-semi · Yokogawa Electric
• Stockers · 3 products
• Wafer marking and ID readers
  SL473 series wafer markers · TOWA LASERFRONT
• Wafer sorters
  ACE SORTER · RORZE

Materials

• Assembly materials
  ECO SOLDER M705 (solder balls) · Senju Metal Industry
• Dicing and backgrinding tapes · 3 products
• EUV resists
  Inpria metal oxide EUV resists · JSR
• Lead frames · 3 products
• Package substrates (FC-BGA) · 4 products
• Photomask blanks
  EUV mask blanks · HOYA
• Photomasks
  EUV photomasks (2 nm generation and beyond) · Dai Nippon Printing (DNP)
• Polysilicon
  11N polysilicon (semiconductor grade) · Tokuyama
• Solder materials
  SN100C · Nihon Superior
• Specialty substrates (sapphire, LT/LN, glass)
  Bonded wafers for SAW filters · NGK Insulators

About these pages

Product information comes from the makers' official product pages and press releases, the same sources used on Semirai's Japanese edition. Specifications are listed as published. For the companies behind the products, see Japanese semiconductor companies.

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