Takatori
A Nara-based precision machinery maker that supplies wire saws for silicon and SiC ingots as well as dicing-related equipment and bonding and debonding systems.
タカトリ・Wafer manufacturing equipment・Last updated: October 27, 2026
Overview
Takatori is headquartered in Kashihara, Nara. It is one of the few makers with equipment for both cutting steps in chipmaking: slicing ingots into wafers and cutting processed wafers.
Its wire saws handle silicon and hard materials such as SiC, and it also makes dicing-related equipment and tape lamination and peeling systems.
Business: Wire saws, dicing-related equipment and bonding/debonding systems
Why it matters
- SiC power device makers need slicing capacity for hard crystals, which has raised interest in wire saw makers.
- Takatori's lineup lets the same supplier serve wafer makers and back-end lines.
Main products
- •Wire saws for ingot slicing
- •Dicing-related equipment
- •Lamination and peeling (bonding/debonding) systems
Sites in Japan
Head officeHeadquarters
Kashihara, Nara
Products (1)
- MWS-SiC6 · Wire saws and wafer slicing equipment