Nippon Micrometal
A Saitama-based Nippon Steel group company specializing in bonding wire and micro balls for semiconductor packages, including palladium-coated copper wire.
日鉄マイクロメタル・Packaging materials・Last updated: October 27, 2026
Overview
Nippon Micrometal is headquartered in Iruma, Saitama, where its main plant is, and has another works in Yorii, Saitama. It focuses on the development, manufacture and sale of bonding wire and micro balls.
Its products include palladium-coated copper bonding wire, which combines the low cost of copper with better resistance to oxidation.
Business: Bonding wire and micro balls
Why it matters
- Copper wire oxidizes easily, and a thin palladium coating makes it practical to use in place of gold.
- Micro balls are used to form bumps and joints in packages.
Main products
- •Palladium-coated copper bonding wire
- •Bonding wire
- •Micro balls
Sites in Japan
Head officeHeadquarters
Iruma, Saitama
Yorii worksPlant
Yorii, Saitama