IBIDEN
A Gifu-based maker of IC package substrates for high-performance processors. In October 2025 it opened its largest domestic plant, in Ono, Gifu, mainly for AI server products.
イビデン・Materials・Last updated: October 22, 2026
Overview
IBIDEN was founded in 1912 and is headquartered in Ogaki, Gifu. Its electronics business makes flip-chip ball grid array (FC-BGA) substrates, the multilayer boards that connect large CPUs and GPUs to the motherboard, built on insulating films such as Ajinomoto's ABF.
In 2021 it announced about 180 billion yen of investment in substrate capacity, including its Gama plant in Ogaki. Its Ono plant held an opening ceremony on October 10, 2025, with mass production starting in stages, mainly for AI servers.
Business: IC package substrates (FC-BGA)
Why it matters
Main products
- •FC-BGA package substrates
- •Ceramic products
Sites in Japan
Ogaki, Gifu
Ogaki, Gifu
Ono, Gifu
Products (1)
- FC-BGA substrates · Package substrates (FC-BGA)