Japanese Semiconductor Packaging Materials Suppliers
Japanese suppliers of the materials that turn dies into packaged chips: package substrates, build-up films, lead frames, bonding wire, solder, underfill, mold compounds and dicing tapes.
- Companies13
- Equipment categories5
- Prefectures with sites10
Overview
Packaging materials connect the die to the outside world, protect it and carry away heat. Advanced packages for AI accelerators and stacked memory need larger substrates, finer wiring and better-matched materials, which has made this area a focus of investment.
Japanese companies supply many of these materials, from insulating build-up film and FC-BGA substrates to bonding wire, solder, underfill and epoxy mold compounds.
Companies (13)
- AjinomotoABF insulating film for package substrates · HQ: Chuo, Tokyo
- IBIDENIC package substrates (FC-BGA) · HQ: Ogaki, Gifu · 1 product page
- Shinko Electric IndustriesFC-BGA package substrates and lead frames · HQ: Nagano, Nagano · 3 product pages
- KyoceraPackage substrates and ceramic components · HQ: Kyoto, Kyoto · 1 product page
- LINTECDicing and backgrinding tapes, tape processing equipment · HQ: Itabashi, Tokyo · 2 product pages
- Mitsui High-tecLead frames · HQ: Kitakyushu, Fukuoka · 1 product page
- Nitto DenkoDicing tapes and functional films · HQ: Osaka, Osaka · 1 product page
- Tanaka Precious MetalsBonding wire and precious metal sputtering targets · HQ: Chiyoda, Tokyo
- Senju Metal IndustrySolder, flux and solder balls · HQ: Adachi, Tokyo · 1 product page
- NamicsUnderfill and die attach materials · HQ: Niigata, Niigata
- Sumitomo BakeliteEpoxy mold compounds and package materials · HQ: Tokyo
- DenkaSilica and alumina fillers for mold compounds · HQ: Chuo, Tokyo
- Nippon MicrometalBonding wire and micro balls · HQ: Iruma, Saitama
Equipment categories
Product categories where these companies are listed, with the number of companies from this page in each.
Related reading
Other materials sectors: Wafers, substrates and photomasks · Process chemicals, gases and targets · Equipment parts and consumables
Japanese companies by sector
- Japanese semiconductor companies
- Japanese Equipment Parts and Consumables Suppliers
- Japanese Chipmakers, Foundries and OSATs
- Japanese Power, Optical and Sensor Device Makers
- Japanese Wafer Processing Equipment Makers
- Japanese Semiconductor Inspection and Metrology Makers
- Japanese Wafer Manufacturing Equipment Makers
- Japanese Back-End and Packaging Equipment Makers
Japanese Semiconductor Packaging Materials Suppliers
Last updated: October 27, 2026