Shinko Electric Industries

A Nagano-based maker of package substrates and lead frames. Formerly a Fujitsu subsidiary, it was acquired in 2025 by a consortium led by the state-backed Japan Investment Corporation (JIC).

新光電気工業・Materials・Last updated: October 22, 2026

Overview

Shinko is headquartered in Nagano city and makes FC-BGA substrates for processors, lead frames and other packaging components, with plants in Nagano and Niigata prefectures.

In February 2025 a company owned by JIC funds (80%), Dai Nippon Printing (15%) and Mitsui Chemicals (5%) launched a tender offer for Shinko, after competition approvals in Japan, South Korea, Vietnam and China. The offer succeeded in March 2025, and Fujitsu sold its stake.

Business: FC-BGA package substrates and lead frames

Why it matters

The JIC-led takeover follows the same pattern as JSR: the government taking key semiconductor materials suppliers private.

Together with IBIDEN, Shinko gives Japan a major share of high-end package substrate supply.

Main products

•FC-BGA package substrates
•Lead frames
•Other packaging components

Sites in Japan

Head officeHeadquarters

Nagano, Nagano

Wakaho plantPlant

Nagano, Nagano

Takaoka plantPlant

Nakano, Nagano

Arai plantPlant

Myoko, Niigata

Kyogase plantPlant

Agano, Niigata

Products (3)

DLL® / DLL3® (flip-chip package substrates) · Package substrates (FC-BGA)
i-THOP® (substrate for 2.3D packages) · Interposer assembly equipment
QFN/QFP and TSOP lead frames · Lead frames

Hokuriku & Koshinetsu semiconductor region

Sources

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