MWS-SiC6
Takatori's multi-wire saw designed for cutting 6-inch SiC. A rigid structure and control system aim at stable, high-precision cutting.
Maker: Takatori · Official product page
Specifications
| Cutting method | Multi-wire saw (diamond-containing oil supply) |
|---|---|
| Supported ingots | 6-inch SiC (models up to 10 inch also available) |
| Related models | MWS-SiC8 |
| Main applications | Slicing wafers from SiC ingots |
Specifications as published by the maker. See the sources below.
Overview
MWS-SiC6 is Takatori's multi-wire saw for SiC ingots. Many wires run side by side to cut many wafers at once from hard SiC ingots. It is specified as optimal for cutting 6-inch SiC.
A rigid structure achieves precise cutting, and a control system for stable operation is built in. It has a mechanism that reduces consumption of consumables and functions to monitor and manage operating status.
SiC is very hard, takes a long time to cut and drives up the cost of consumables such as wire. As demand for substrates grows with the spread of SiC power devices, the stability and cost of the cutting process have become important.
Key features
- Cutting 6-inch SiC ingots
- Precise cutting with a rigid structure
- Mechanism that reduces consumable consumption
- Monitoring and management of operating status
Applications
- Slicing SiC ingots
Also listed under: Compound semiconductor substrate equipment (SiC/GaN)
Other wire saws and wafer slicing equipment
- DAL7440 · DISCO
Sources
Wafer manufacturing equipment: more products
Last updated: October 23, 2026