ASE-Pegasus
A production silicon deep etching system that adds proprietary technology to the Bosch process. It combines vertical profiles and low sidewall roughness with high selectivity and high etch rate.
Maker: SPP Technologies · Official product page
Specifications
| Etching method | Silicon deep etching (Bosch process) |
|---|---|
| Positioning | Production tool (MUC-21 ASE-SRE also available for R&D) |
| Main applications | Silicon deep etching for MEMS and semiconductors |
Specifications as published by the maker. See the sources below.
Overview
Pegasus is SPP Technologies' silicon deep reactive ion etching (DRIE) system. It has more than 20 years of sales in silicon deep RIE for MEMS and semiconductors and is recognized as the de facto standard for silicon deep etching in MEMS manufacturing.
ASE (Advanced Silicon Etch) is a DRIE method that etches deep, high aspect ratio structures into silicon at high speed. Pegasus carries on STS's ASE technology and, with a deep understanding of the Bosch process, which alternates etching and passivation, achieves excellent profile control and selectivity.
The combination of high-performance hardware and process control software delivers industry-leading etch rates, mask selectivity and high aspect ratio etching in volume production. It is used to make gyro sensors and acceleration sensors, and also for TSV etching on CMOS lines. There is also Pegasus300 for 300 mm.
Key features
- Deep etching by ASE (Bosch process)
- Industry-leading etch rate and mask selectivity
- High aspect ratio etching
- Pegasus300 for 300 mm
Applications
- Manufacturing MEMS such as gyro and acceleration sensors
- TSV etching
Also listed under: TSV formation equipment
Other mems manufacturing equipment
Sources
MEMS manufacturing equipment
Last updated: October 23, 2026