TSV formation equipment
TSV (through-silicon via) formation covers the steps that make vertical electrical connections through a thinned silicon wafer: etching deep vias, lining and filling them with metal, temporarily bonding the wafer to a carrier, thinning it from the back to reveal the vias, and debonding.
What it does
TSVs connect stacked dies in HBM, 3D-stacked image sensors and other 3D packages. Equipment in this category includes temporary bonders and debonders and the metrology used to control via depth and remaining silicon thickness.
Products (5)
- UFP600AS · Ebara
Ebara's electroplating system that forms bumps, redistribution layers, vias and other structures on rectangular package substrates. A high-speed paddle method combines fast plating with within-substrate uniformity.
- BGM300 · Lasertec
A measurement system for the TSV backside grinding process that measures Si thickness, TSV depth and remaining Si thickness.
- VIANCA series · Lasertec
A via depth measurement system that accurately measures the depth of small, high aspect ratio vias in 3D and 2.5D packages and hybrid bonding.
- ASE-Pegasus · SPP Technologies
A production silicon deep etching system that adds proprietary technology to the Bosch process. It combines vertical profiles and low sidewall roughness with high selectivity and high etch rate.
- Synapse™ V / Synapse™ Z Plus · Tokyo Electron (TEL)
TEL's bonder and debonder for temporary wafer bonding (Synapse V) and debonding and cleaning (Synapse Z Plus) in the TSV process.
Japanese makers in this category
- Ebara · 1 product(s) listed
- Lasertec · 2 product(s) listed
- SPP Technologies · 1 product(s) listed
- Tokyo Electron (TEL) · 1 product(s) listed
Other back-end equipment
- Analog test systems (3)
- Backgrinders (9)
- Burn-in systems (3)
- Dicing saws (13)
- Electron microscopes for observation (SEM/TEM) (3)
- Final test equipment (4)
- Laser dicing equipment (9)
- Memory test systems (10)
- Organic analysis instruments (3)
- Surface analysis instruments (XPS/SIMS) (4)
- Test handlers (5)
- Thermal analysis instruments (TG-DTA/DSC) (3)
Sources
Related calculators
Japanese equipment by category
TSV formation equipment
Last updated: October 23, 2026