Dicing blades and consumables
FTB/CCB series hub blades
Tokyo Seimitsu (ACCRETECH)'s hub blades with an aluminum base. They are used mainly for dicing silicon wafers.
Specifications
| Bond and shape | Hub blade (with aluminum base) |
|---|---|
| Supported materials | Si, GaAs and other wafers |
| Main applications | Wafer dicing |
Specifications as published by the maker. See the sources below.
Overview
The FTB/CCB series are Tokyo Seimitsu (ACCRETECH)'s hub blades. They are dicing blades with an aluminum base, used to cut wafers into chips.
Besides mainly silicon wafers, they are used to dice a variety of wafers such as GaAs.
Key features
- Hub blade with an aluminum base
- Supports Si, GaAs and other wafers
Applications
- Wafer dicing
Other dicing blades and consumables
- NBC-Z series · DISCO
- ZH05 · DISCO
More from Tokyo Seimitsu (ACCRETECH)
- AD3000T-PLUS · Dicing saws
- ChaMP211 · Metal CMP equipment
- ChaMP332 · Oxide CMP equipment
- UF3000EX-e · Wafer probers
Sources
Dicing blades and consumables
Last updated: October 23, 2026