ZH05
DISCO's electroformed-bond dicing blade. Concentration control technology offers 5 levels of diamond concentration, balancing backside chipping and blade life.
Maker: DISCO · Official product page
Specifications
| Bond and shape | Electroformed bond, hub blade |
|---|---|
| Supported materials | Si, compound semiconductors (GaAs, GaP), oxides (LiTaO₃) |
| Main applications | Wafer dicing |
Specifications as published by the maker. See the sources below.
Overview
ZH05 is a hub blade (dicing blade) from DISCO. Its cutting edge is made of diamond abrasive held in an electroformed bond, and it is mounted on a dicing saw to cut wafers.
It is used to cut silicon wafers, compound semiconductor wafers such as GaAs and GaP, and oxide wafers such as LiTaO₃. Concentration control technology, with a lineup of 5 concentration levels (abrasive density), gives an excellent balance between processing quality and blade life.
It includes technology that reduces backside chipping and is also expected to shorten pre-cut (dressing) time. A -K version with more uniform blade sides is also available.
Key features
- Electroformed-bond hub blade
- Lineup of 5 concentration levels
- Reduced backside chipping
- Shorter pre-cut time, -K version
Applications
- Dicing of silicon, compound semiconductor and oxide wafers
Other dicing blades and consumables
- NBC-Z series · DISCO
- FTB/CCB series hub blades · Tokyo Seimitsu (ACCRETECH)
More from DISCO
Sources
Dicing blades and consumables
Last updated: October 23, 2026