AD3000T-PLUS
A dicing machine from Tokyo Seimitsu (ACCRETECH). It supports ABES, which detects hub blade life and replaces blades automatically, limiting downtime.
Specifications
| Wafer size | 300 mm |
|---|---|
| Spindle | Facing dual (1.8 kW, up to 60,000 rpm; 2.2 kW high-torque version optional) |
| Axis speed | X 1,000 mm/s, Y 300 mm/s, Z 80 mm/s |
| Automation | Can carry an automatic blade exchange system (ABES) |
| Footprint | Angled layout fits 5 units in the space of 4 earlier units |
| Related models | AD3000T-HC PLUS / AD3000TW (for large packages such as FOWLP) |
| Main applications | Blade dicing of wafers and packages |
Specifications as published by the maker. See the sources below.
Overview
AD3000T-PLUS is a Φ300 mm dicing machine from Tokyo Seimitsu (ACCRETECH). Its own angled layout places two facing spindles at an angle, allowing processing with less wasted X-axis movement.
The angled layout also helps footprint: 5 units are said to fit in the space of 4 earlier units. All operation and maintenance are done from the front of the tool, which is designed for adding units on volume production lines.
The standard spindle is 1.8 kW at up to 60,000 rpm, and a 2.2 kW high-torque version is optional. An automatic blade exchange system (ABES) can also be installed, and the 17-inch touch panel GUI shares its operating system with Tokyo Seimitsu's AD and SS series.
Key features
- Facing dual spindles placed at an angle to minimize X-axis movement
- Space-saving design that fits 5 units in the space of 4 earlier units (all operation and maintenance from the front)
- Can carry an automatic blade exchange system (ABES)
- Axis speeds of X 1,000 mm/s, Y 300 mm/s and Z 80 mm/s; Z-axis repeatability of 0.001 mm
- 17-inch touch panel GUI (control system shared with the AD and SS series)
Applications
- Blade dicing of wafers on Φ300 mm volume production lines
- Cutting a wide range of workpieces from silicon to electronic components
FAQ
What is the maximum workpiece size of AD3000T-PLUS?
The maximum workpiece size is Φ305 mm, and frames up to 12 inch are supported.
How does it differ from DISCO's dicing saws?
Both use facing dual spindles, but AD3000T-PLUS highlights its angled spindle layout and the small footprint per unit. See the specifications above for item-by-item details.
Other dicing saws
More from Tokyo Seimitsu (ACCRETECH)
- ChaMP211 · Metal CMP equipment
- ChaMP332 · Oxide CMP equipment
- FTB/CCB series hub blades · Dicing blades and consumables
- UF3000EX-e · Wafer probers
Sources
Last updated: October 23, 2026