NBC-Z series
A high-performance ultra-thin electroformed blade that combines grinding power with long life.
Maker: DISCO · Official product page
Specifications
| Bond and shape | Electroformed bond, ultra-thin blade |
|---|---|
| Supported materials | Semiconductor wafers, ceramics, CSP packages |
| Main applications | Deep cuts, grooving, package cutting |
Specifications as published by the maker. See the sources below.
Overview
The NBC-Z series are electroformed-bond hubless blades from DISCO. DISCO's own technology gives them high grinding power and long blade life.
The ultra-thin edge allows deep cuts and grooving, with blade thicknesses from 0.015 mm to 0.3 mm. A wide choice of grit sizes and bonds covers everything from dicing compound semiconductors to cutting ceramics. They can be used on dicing saws and slicers.
The NBC-Z type emphasizes blade strength even when ultra-thin and suits dicing of narrow streets and grooving. The NBC-ZB type improves the condition of the blade sides to reduce front-side chipping and slanted cuts. They are used to cut silicon wafers, compound semiconductors such as GaAs and GaP, semiconductor packages, ceramics and CSPs.
Key features
- Electroformed bond, blade thickness 0.015 to 0.3 mm
- High grinding power and long life
- NBC-Z (strength) and NBC-ZB (less chipping)
Applications
- Narrow-street dicing of silicon and compound semiconductors
- Cutting packages, ceramics and CSPs
Other dicing blades and consumables
- ZH05 · DISCO
- FTB/CCB series hub blades · Tokyo Seimitsu (ACCRETECH)
More from DISCO
Sources
Dicing blades and consumables
Last updated: October 23, 2026