ChaMP211
Tokyo Seimitsu's CMP system that puts CMP technology developed for volume production lines into a compact tool. It handles φ100 to 200 mm and is intended for polishing SiC, MEMS, micro LEDs, SAW filters and more.
Specifications
| Positioning | Compact CMP system |
|---|---|
| Wafer size | 100 / 150 / 200 mm (polishing heads for 2 to 8 inch) |
| Polishing head | Sylphide air-float head (zone control optional) |
| Coverage | From R&D and prototyping to volume production (supports specification changes) |
| Series | ChaMP211 / ChaMP232 (200 mm) / ChaMP332 (300 mm) |
| Main applications | Polishing SiC, MEMS, micro LEDs and SAW filters |
Specifications as published by the maker. See the sources below.
Overview
ChaMP211 is Tokyo Seimitsu's CMP system that puts CMP technology developed on volume production lines into a compact tool. It handles Φ100/150/200 mm wafers, with polishing heads for 2 to 8 inch.
The maker's intended applications are devices such as SiC, MEMS, micro LEDs and SAW filters. Its low price and small footprint, along with support for changes to the tool specification, let one tool cover R&D, prototyping and volume production.
The polishing head is the same Sylphide air-float type as on higher models, giving uniform pressure across the wafer, stability at low pressure and good edge profile control. With a wafer loader and cleaning unit, it runs fully automatically, and an optical endpoint detection system with a white light source detects changes in remaining film.
Key features
- Compact CMP for Φ100 to 200 mm (low price, small footprint)
- Sylphide air-float head (zone control optional)
- Fully automatic operation with wafer loader and cleaning unit
- Optical endpoint detection with a white light source
- One-touch replacement of retainers and membranes reduces downtime
Applications
- Polishing SiC and compound substrates
- Planarization of MEMS, micro LEDs and SAW filters
- From R&D to low-volume production
FAQ
Can ChaMP211 be used to polish SiC wafers?
The maker describes it as optimal for devices such as SiC, MEMS, micro LEDs and SAW filters. Supported wafers are Φ100/150/200 mm.
Other metal cmp equipment
- F-REX300X · Ebara
More from Tokyo Seimitsu (ACCRETECH)
- AD3000T-PLUS · Dicing saws
- ChaMP332 · Oxide CMP equipment
- FTB/CCB series hub blades · Dicing blades and consumables
- UF3000EX-e · Wafer probers
Sources
Front-end equipment: more products
Last updated: October 23, 2026