ChaMP332
Tokyo Seimitsu (ACCRETECH)'s CMP system for 300 mm wafers. Surface-referenced polishing with the Sylphide air-float head keeps control in the low-pressure range.
Specifications
| Wafer size | 300 mm |
|---|---|
| Polishing head | Sylphide air-float head |
| Pressure method | Uniform pressure through an air film (surface-referenced polishing) |
| Series | ChaMP332 (300 mm) / ChaMP232 (200 mm) / ChaMP211 (compact) |
| Main applications | Planarization of STI and interlayer dielectrics |
Specifications as published by the maker. See the sources below.
Overview
ChaMP332 is Tokyo Seimitsu (ACCRETECH)'s CMP system for Φ300 mm wafers. It aims to meet both the process performance required for advanced devices and the requirements of volume fabs.
Its core technology is the Sylphide air-float polishing head. An air film presses the wafer uniformly, polishing with the wafer surface as the reference. Pressure is applied by an airbag independent of the air film, so control and stability are kept even in the low-pressure range. A zone control function can be added as an option.
Maintainability is also emphasized: the polishing head can be removed in about 5 seconds and installed in about 10 seconds. The series includes ChaMP232 for 200 mm and the compact ChaMP211.
Key features
- Surface-referenced polishing with the Sylphide air-float head
- Stable control even at low pressure with airbag pressure
- Zone control function (optional)
- Polishing head removal and installation in about 5 / 10 seconds
Applications
- Planarization of STI and interlayer dielectrics
- 300 mm volume production lines for advanced devices
Also listed under: STI CMP equipment
Other oxide cmp equipment
- F-REX300XA · Ebara
More from Tokyo Seimitsu (ACCRETECH)
- AD3000T-PLUS · Dicing saws
- ChaMP211 · Metal CMP equipment
- FTB/CCB series hub blades · Dicing blades and consumables
- UF3000EX-e · Wafer probers
Sources
Front-end equipment: more products
Last updated: October 23, 2026