Equipment components and subsystems
Dicing blades and consumables
Dicing blades are thin rotating blades of diamond abrasive held in a bond, used on dicing saws to cut wafers and packages. Hub blades have an aluminum hub; hubless blades are mounted between flanges.
What it does
Blade thickness, grit size and bond type are chosen for the material, from silicon and compound semiconductors to glass, ceramics and package substrates.
Products (3)
- NBC-Z series · DISCO
A high-performance ultra-thin electroformed blade that combines grinding power with long life.
- ZH05 · DISCO
DISCO's electroformed-bond dicing blade. Concentration control technology offers 5 levels of diamond concentration, balancing backside chipping and blade life.
- FTB/CCB series hub blades · Tokyo Seimitsu (ACCRETECH)
Tokyo Seimitsu (ACCRETECH)'s hub blades with an aluminum base. They are used mainly for dicing silicon wafers.
Japanese makers in this category
- DISCO · 2 product(s) listed
- Tokyo Seimitsu (ACCRETECH) · 1 product(s) listed
Other equipment components and subsystems
Sources
Japanese equipment by category
Dicing blades and consumables
Last updated: October 23, 2026