Denka
A Tokyo-based chemical company whose electronics business supplies fused and spherical silica fillers for semiconductor mold compounds, spherical alumina for thermal materials and circuit substrates.
デンカ・Packaging materials・Last updated: October 27, 2026
Overview
Denka is headquartered in Chuo, Tokyo. Its electronics and advanced products business makes fused silica and spherical silica, which are the main fillers in epoxy mold compounds, and spherical alumina for heat-dissipating materials.
It has developed low-dielectric-loss silica for high-frequency applications and also makes circuit substrates and electronic packaging materials.
Business: Silica and alumina fillers for mold compounds
Why it matters
- Silica filler makes up most of a mold compound by weight and lowers its thermal expansion toward that of silicon.
- Spherical particles flow better, so more filler can be packed into the resin.
Main products
- •Fused and spherical silica fillers
- •Spherical alumina
- •Circuit substrates and electronic packaging materials
Sites in Japan
Head officeHeadquarters
Chuo, Tokyo