Mitsuboshi Diamond Industrial
An Osaka-based maker of cutting equipment and scribing wheels that began as a glass-cutting tool maker, now applying scribe-and-break technology to cut SiC and other hard semiconductor wafers.
三星ダイヤモンド工業・Back-end and packaging equipment・Last updated: October 27, 2026
Overview
Mitsuboshi Diamond Industrial is headquartered in Settsu, Osaka. It makes both the cutting tool (the scribing wheel) and the scribe and break equipment, and is known for cutting systems for LCD panels.
In semiconductors it applies scribe-and-break, which scores a line on the wafer and then breaks it, to fast cutting of SiC and other hard and brittle wafers.
Business: Scribe-and-break cutting systems and scribing wheels
Why it matters
- Blade dicing of SiC is slow and wears blades quickly, so scribe-and-break is one of the alternatives used for SiC power devices.
- Making the cutting wheel in house lets the company tune tool and machine together.
Main products
- •Scribing systems
- •Breaking systems
- •Scribing wheels
Sites in Japan
Head officeHeadquarters
Settsu, Osaka