Fasford Technology
A Japanese maker of die bonders for stacked memory packages and general-purpose packages.
ファスフォードテクノロジ・Equipment・Last updated: October 23, 2026
Overview
Fasford Technology makes die bonders, which attach singulated chips to lead frames or substrates. Its DB830plus+ series uses a 2-in-1 concept that handles both DAF processes for stacked packages and paste processes for general-purpose products in one tool, with multi-level stacking and thin die pickup.
The DB820, developed from the DB830plus+, targets paste processes for logic and analog products and handles dies as small as 0.3 mm square.
Business: Die bonders
Why it matters
Stacked memory packages require bonding thin dies precisely in many layers, which puts demands on pickup and placement accuracy.
Main products
- •Die bonders (DB830plus+ series, DB820)
Products (2)
- DB820 · Die bonders
- DB830plus+ series · Die bonders