DISCO
The specialist in cutting, grinding and polishing wafers ("Kiru, Kezuru, Migaku"). DISCO makes dicing saws, laser saws and grinders, together with the blades and wheels they consume.
ディスコ・Equipment・Last updated: October 15, 2026
Overview
DISCO was founded in 1937 as a maker of grinding wheels and is headquartered in Omori, Ota, Tokyo. Its main manufacturing base is the Kuwabata plant in Kure, Hiroshima.
After front-end processing, wafers are thinned by grinding and then singulated into individual dies. DISCO supplies both the machines and the consumable blades and wheels for these steps.
Business: Dicing, grinding and polishing equipment
Why it matters
Advanced packaging such as stacked memory (HBM) depends on very thin wafers and precise singulation, which is DISCO's core field.
Consumables (blades and wheels) give DISCO recurring revenue tied to fab utilization, not only to new equipment orders.
Main products
- •Dicing saws (blade dicing)
- •Laser saws (laser dicing)
- •Grinders and polishers for wafer thinning
- •Dicing blades and grinding wheels
Sites in Japan
Head officeHeadquarters
Ota, Tokyo
Kuwabata plantPlant
Kure, Hiroshima
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