Shinkawa (Yamaha Robotics)
A Japanese maker of wire bonders and die bonders for semiconductor packaging, now part of Yamaha Robotics, whose bonders are sold as the SHINKAWA series for power semiconductor and LED packages.
新川・Back-end and packaging equipment・Last updated: October 27, 2026
Overview
Shinkawa made wire bonding equipment, including ball bonders and wedge bonders, and high-precision die bonders. It joined the Yamaha Motor group in 2019 and was merged into Yamaha Robotics in 2025, and its equipment continues as the SHINKAWA series.
Wire bonding connects pads on the chip to the package with fine metal wire and is still the most widely used interconnect method for packaged chips.
Business: Wire bonders and die bonders
Why it matters
- Power devices often use thick aluminium or copper wire and wedge bonding, a different process from the fine gold or copper ball bonding used in logic packages.
- Within Yamaha Robotics, Shinkawa's bonders sit alongside Apic Yamada's molding systems.
Main products
- •Ball bonders
- •Wedge bonders
- •High-precision die bonders