TOWA
A Kyoto-based maker of molding equipment that seals chips in resin during packaging. It is known for compression molding, which suits thin and large advanced packages.
TOWA・Equipment・Last updated: October 22, 2026
Overview
TOWA was founded in 1979 and is headquartered in Kyoto. Its core products are molding systems, both transfer and compression types, along with singulation equipment and precision molds.
Molding is one of the last steps of packaging: the chip and its wires or bumps are covered with resin to protect them. Compression molding presses resin over the whole substrate at once, which helps with large packages and stacked dies.
Business: Molding (encapsulation) equipment for chip packaging
Why it matters
Advanced packages for AI chips and stacked memory are larger and thinner, which puts more weight on molding quality.
TOWA is one of several Japanese back-end equipment specialists, alongside DISCO, Advantest and Tokyo Seimitsu.
Main products
- •Compression molding systems
- •Transfer molding systems
- •Singulation equipment
- •Precision molds
Sites in Japan
Head officeHeadquarters
Kyoto, Kyoto
Products (1)
- CPM1080 · Molding (encapsulation) equipment