Japanese Back-End and Packaging Equipment Makers
Japanese makers of assembly and packaging equipment: dicing and grinding, die and wire bonding, flip-chip bonding, molding, dispensing and solder ball mounting, the steps that follow wafer processing.
- Companies11
- Equipment categories10
- Prefectures with sites7
Overview
After front-end processing, wafers are thinned, cut into dies, attached to substrates or lead frames, connected and encapsulated. Advanced packaging, such as stacked memory and chiplets, has made these steps more demanding and raised their share of equipment spending.
Japanese companies are strong in this part of the supply chain: dicing and grinding, molding, wire and die bonding all have established Japanese specialists.
Companies (11)
- DISCODicing, grinding and polishing equipment · HQ: Ota, Tokyo · 40 product pages
- Tokyo Seimitsu (ACCRETECH)Wafer probers, dicing and grinding machines, metrology · HQ: Hachioji, Tokyo · 5 product pages
- TOWAMolding (encapsulation) equipment for chip packaging · HQ: Kyoto, Kyoto · 1 product page
- Fasford TechnologyDie bonders · 2 product pages
- Musashi EngineeringDispensers · 2 product pages
- Shinkawa (Yamaha Robotics)Wire bonders and die bonders
- KaijoWire bonders and ultrasonic cleaning systems · HQ: Tokyo
- Apic Yamada (Yamaha Robotics)Molding (encapsulation) equipment for semiconductor packages · 1 product page
- Toray EngineeringFlip-chip bonders, die bonders and visual inspection systems · HQ: Tokyo
- Shibuya CorporationSolder ball mounters, die and flip-chip bonders, test handlers · HQ: Kanazawa, Ishikawa
- Mitsuboshi Diamond IndustrialScribe-and-break cutting systems and scribing wheels · HQ: Settsu, Osaka
Equipment categories
Product categories where these companies are listed, with the number of companies from this page in each.
Related reading
Other equipment sectors: Wafer processing equipment · Inspection and metrology · Wafer manufacturing equipment · Test and reliability equipment · Equipment components · Fab infrastructure
Japanese companies by sector
- Japanese semiconductor companies
- Japanese Semiconductor Test Equipment Makers
- Japanese Semiconductor Equipment Component Suppliers
- Japanese Cleanroom and Fab Infrastructure Suppliers
- Japanese Wafer, Substrate and Photomask Suppliers
- Japanese Semiconductor Process Materials Suppliers
- Japanese Semiconductor Packaging Materials Suppliers
- Japanese Equipment Parts and Consumables Suppliers
Last updated: October 27, 2026