Namics
A Niigata-based maker of functional materials for semiconductor packaging, including underfill resins, die attach materials and anisotropic conductive films.
ナミックス・Packaging materials・Last updated: October 27, 2026
Overview
Namics is headquartered in Niigata. It makes materials for joining and protecting chips in packages: underfill resins, die attach materials and anisotropic conductive films (ACF).
Die attach materials fix the die to a lead frame or substrate and must carry heat and sometimes current away from it. In stacked memory packages, thin die attach films are laminated between dies so that many dies can be stacked without the package becoming too thick.
Business: Underfill and die attach materials
Why it matters
- Underfill fills the gap between a flip-chip die and its substrate and spreads mechanical stress away from the solder bumps.
- Larger dies and packages for AI chips put more stress on bumps, which makes underfill more important.
Main products
- •Underfill resins
- •Die attach materials
- •Anisotropic conductive films (ACF)
Sites in Japan
Head officeHeadquarters
Niigata, Niigata