Sumitomo Bakelite
A Tokyo-based plastics company that began with phenolic resins and whose main semiconductor product is epoxy mold compound for encapsulating chips, along with substrate and photosensitive materials.
住友ベークライト・Packaging materials・Last updated: October 27, 2026
Overview
Sumitomo Bakelite is headquartered in Tokyo. In semiconductors its main product is epoxy molding compound (EMC), the resin that encapsulates chips in a package.
It also supplies materials for package substrates and photosensitive materials, and makes molding compounds at production sites outside Japan.
Business: Epoxy mold compounds and package materials
Why it matters
- The mold compound must match the thermal expansion of the die and substrate to avoid warpage and cracking.
- Molding compounds are formulated for each package type, so materials and molding equipment are qualified together.
Main products
- •Epoxy molding compounds
- •Package substrate materials
- •Photosensitive materials
Sites in Japan
Head officeHeadquarters
Tokyo