Shibuya Corporation
A Kanazawa-based industrial machinery maker whose semiconductor systems business makes solder ball mounters for substrates and wafers, high-precision die bonders, flip-chip bonders, wire bonders and test handlers.
澁谷工業・Back-end and packaging equipment・Last updated: October 27, 2026
Overview
Shibuya Corporation is headquartered in Kanazawa, Ishikawa. Besides bottling and pharmaceutical systems, it has a semiconductor manufacturing systems business.
Its lineup covers solder ball mounters for package substrates and wafers, high-precision die bonders for optical communication devices and image sensors, flip-chip bonders, wire bonders and handlers for power semiconductors. The ultrasonic equipment maker Kaijo is a group company.
Business: Solder ball mounters, die and flip-chip bonders, test handlers
Why it matters
- Ball mounters place the solder balls that connect a BGA package to the board, or bumps on a wafer, so placement accuracy affects every joint.
- Covering mounting, bonding and handling gives Shibuya a broad presence across the back end.
Main products
- •Solder ball mounters (substrate and wafer)
- •High-precision die bonders
- •Flip-chip bonders
- •Wire bonders and test handlers
Equipment categories
Categories where Shibuya Corporation is listed, with other Japanese makers and their products:
Sites in Japan
Kanazawa, Ishikawa