Apic Yamada (Yamaha Robotics)
A Nagano-based maker of molding equipment for semiconductor packages, now part of Yamaha Robotics, whose transfer and compression molding systems are sold as the APIC YAMADA series.
アピックヤマダ・Back-end and packaging equipment・Last updated: October 27, 2026
Overview
Apic Yamada was based in Chikuma, Nagano and specialized in molding equipment that encapsulates chips in resin. It joined the Yamaha Motor group in 2019 and was merged into Yamaha Robotics in 2025; its equipment continues as the APIC YAMADA series.
The lineup covers transfer molding systems, which push resin into a closed mold, and compression molding systems, which press resin over the whole substrate, including large-area systems for fan-out and panel-level packages.
Business: Molding (encapsulation) equipment for semiconductor packages
Why it matters
- Compression molding suits thin packages and large wafers or panels because the resin does not have to flow far across the dies.
- Within Yamaha Robotics, molding sits alongside Shinkawa's bonders, giving one supplier several back-end steps.
Main products
- •Transfer molding systems
- •Compression molding systems
- •Encapsulation-related equipment
Sites in Japan
Chikuma, Nagano
Chikuma, Nagano
Products (1)
- WCM-330 · Molding (encapsulation) equipment