Toray Engineering
The engineering company of the Toray group, whose semiconductor products include flip-chip bonders and die bonders for advanced packaging, visual inspection systems and coating equipment.
東レエンジニアリング・Back-end and packaging equipment・Last updated: October 27, 2026
Overview
Toray Engineering is based in Tokyo and is part of the Toray group. In semiconductors it supplies assembly equipment, mainly flip-chip bonders and die bonders, as well as visual inspection systems and coating equipment.
Flip-chip bonders place a die face down and join its bumps to a substrate or another die, which requires precise alignment and control of heat and force.
Business: Flip-chip bonders, die bonders and visual inspection systems
Why it matters
- Chiplet and stacked-die packages need bonding with alignment accuracy in the micrometre range, which puts flip-chip bonders at the centre of advanced packaging lines.
- Having both bonding and inspection equipment lets the company cover assembly and its quality checks.
Main products
- •Flip-chip bonders
- •Die bonders
- •Visual inspection systems
Sites in Japan
Head officeHeadquarters
Tokyo