WCM-330
A fully automatic WLP molding system that handles wafer loading and unloading, resin supply, encapsulation and visual inspection inline. It has a mechanical press developed specifically for WLP.
Maker: Apic Yamada · Official product page
Specifications
| Molding method | Compression molding (mechanical press dedicated to WLP) |
|---|---|
| Supported workpieces | 8/12-inch wafers, SUS carriers (WCM-330 MS) |
| Supported resins | Liquid and granular compounds |
| Related models | WCM-330 MS |
| Main applications | FOWLP, FIWLP, EWLP |
Specifications as published by the maker. See the sources below.
Overview
WCM-330 is the wafer compression molding system of Yamaha Robotics (Apic Yamada). It is a fully automatic molding system for wafer-level packages such as FOWLP, FIWLP and eWLB.
It handles 8-inch and 12-inch wafers, φ350 mm SUS carriers and 320 × 320 mm glass panels. It has an 85-ton press and also supports molded underfill (MUF). Both liquid and granular resins can be used, and upper and lower FAME (film assist) and 8-step resin flow control improve molding quality.
Parts that touch the wafer have ESD protection. Chip counting, visual inspection, post-cure and an IP camera are options. Throughput is about 14 wafers per hour with a 400-second cure and 150-second dispense, processing 1 wafer per molding cycle.
Key features
- Fully automatic wafer compression molding
- 85-ton press, supports MUF
- Liquid and granular resins, upper and lower FAME, 8-step resin flow control
- 8/12-inch wafers, SUS carriers and glass panels
Applications
- Resin encapsulation for FOWLP, FIWLP and eWLB
Other molding (encapsulation) equipment
- CPM1080 · TOWA
Sources
Last updated: October 23, 2026