Equipment by device type

Power semiconductor manufacturing equipment

Power semiconductors such as IGBTs, power MOSFETs and SiC and GaN devices switch and convert electricity in vehicles, industrial equipment, railways and power grids. They are usually made on 150 mm and 200 mm wafers and need steps that logic lines rarely use, such as deep trench etching, thin wafer handling and backside processing.

Products4
Japanese makers3

What it does

Equipment in this category includes etchers and other process tools tuned for power devices, and test systems that apply the high voltages and currents these devices must withstand.

Products (4)

EXAVIS · Advantest
The first integrated test platform that can test every kind of power semiconductor, from wafers to complex modules.
MT100 / MT200 · Advantest
DC and AC test systems for power semiconductors such as IGBTs, MOSFETs, SiC and GaN. Up to 10 kV-10 kA for DC and 6 kV-18 kA for AC.
M-600 / 6000 series · Hitachi High-Tech
Etching systems for silicon processing of power semiconductors. They handle 150 mm and 200 mm wafers and produce smooth sidewalls with low-temperature etching and TM bias.
SU-3300 · SCREEN Holdings
SCREEN's single-wafer cleaning system. It carries up to 24 chambers in 4 levels × 6 towers and performs chemical wet etching and cleaning with high productivity.

Power semiconductor manufacturing equipment

What it does

Products (4)

Japanese makers in this category

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Power semiconductor manufacturing equipment