Wafer probers
A wafer prober positions each chip on a wafer under the needles of a probe card so that a tester can check it electrically before the wafer is diced. It handles wafer loading, alignment, temperature control and contact between the probe card and the chip pads.
What it does
Wafer test screens out defective chips before packaging and is essential for KGD (known good die) in advanced packages that stack or combine several chips. Memory test often contacts many chips, or a whole wafer, in one touchdown.
Products (8)
- HA1200 · Advantest
A prober that tests singulated dies under high-heat conditions. It selects good dies before chiplets are stacked, reducing yield loss.
- Cellcia™ · Tokyo Electron (TEL)
TEL's next-generation test platform with a stacked multi-cell structure, in which each cell independently tests a whole 300 mm wafer at once.
- Precio octo™ · Tokyo Electron (TEL)
TEL's wafer prober for 8-inch wafers, with very fast indexing and fast wafer exchange for higher productivity.
- Precio™ XL · Tokyo Electron (TEL)
Tokyo Electron's fully automatic 200/300 mm wafer prober driven by linear motors. It offers high-speed probe mark inspection and automatic probe card leveling.
- Prexa™ · Tokyo Electron (TEL)
TEL's next-generation fully automatic 300 mm wafer prober that builds on Precio technology, with fewer error assists and more automation.
- Prexa™ MS · Tokyo Electron (TEL)
TEL's fully automatic 300 mm prober for memory wafer test. It supports probing loads up to 1,000 kg and heat absorption control for high heat generation.
- WDF™ 12DP+ · Tokyo Electron (TEL)
TEL's dicing frame prober that transfers and tests both 300 mm wafers and 300 mm dicing frames without a change kit.
- UF3000EX-e · Tokyo Seimitsu (ACCRETECH)
A fully automatic wafer prober from Tokyo Seimitsu (ACCRETECH). A newly developed XY stage drive and algorithms give high throughput.
Japanese makers in this category
- Advantest · 1 product(s) listed
- Tokyo Electron (TEL) · 6 product(s) listed
- Tokyo Seimitsu (ACCRETECH) · 1 product(s) listed
Other back-end equipment
- Analog test systems (3)
- Backgrinders (9)
- Burn-in systems (3)
- Dicing saws (13)
- Electron microscopes for observation (SEM/TEM) (3)
- Final test equipment (4)
- Laser dicing equipment (9)
- Memory test systems (10)
- Organic analysis instruments (3)
- Surface analysis instruments (XPS/SIMS) (4)
- Test handlers (5)
- Thermal analysis instruments (TG-DTA/DSC) (3)
Sources
Japanese equipment by category
Last updated: October 23, 2026