Final test equipment
Final test checks packaged chips, or singulated dies, electrically before they are shipped. A tester applies signals and power while a handler moves the devices and holds them at the test temperature.
What it does
Besides conventional ATE, final test now includes system-level test (SLT), which runs devices as they would operate in a product, and testers built for specific devices such as power semiconductors.
Products (4)
- 7038 System-Level Test System · Advantest
A low-cost system-level test (SLT) system for high-volume production that tests up to 720 devices at once at 5,000 UPH.
- T2000 · Advantest
Advantest's SoC test system configured by combining functional modules. It performs low-cost volume testing of complex consumer devices.
- DIS100 · DISCO
A chip inspection system that picks chips from diced wafers and fully automatically measures thickness, chipping, backside roughness and die strength.
- Prexa™ SDP · Tokyo Electron (TEL)
TEL's prober for testing singulated devices. It has its own temperature control for high-heat devices.
Japanese makers in this category
- Advantest · 2 product(s) listed
- DISCO · 1 product(s) listed
- Tokyo Electron (TEL) · 1 product(s) listed
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Sources
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Japanese equipment by category
Final test equipment
Last updated: October 23, 2026