Polishing pads and carrier parts
Polishing pads are the consumables that, together with slurry, remove material and flatten the wafer surface in CMP and in silicon wafer polishing. Foamed polyurethane pads are standard for device CMP, while impregnated nonwoven pads are used for wafer stock removal.
What it does
Pad hardness, porosity and groove pattern affect removal rate, uniformity and defects.
Products (3)
- GLANZOX · Fujimi Incorporated
A colloidal silica polishing material for silicon wafers aimed at high flatness and mirror surfaces free of damage and heavy-metal contamination. Introduced in 1967.
- IC1000™ series · Nitta DuPont
A polyurethane CMP pad with uniform fine foam. It is regarded as the industry standard for CMP pads.
- Suba™ series · Nitta DuPont
Polishing pads made of polyester nonwoven fabric impregnated with polyurethane. They were developed for primary and secondary polishing of silicon wafers.
Japanese makers in this category
- Fujimi Incorporated · 1 product(s) listed
- Nitta DuPont · 2 product(s) listed
Other equipment components and subsystems
Sources
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Polishing pads and carrier parts
Last updated: October 23, 2026