Specialty substrates (sapphire, LT/LN, glass)
Bonded wafers for SAW filters
Bonded wafers that join a thinned piezoelectric single crystal directly to low-thermal-expansion silicon at room temperature, without adhesive.
Maker: NGK Insulators · Official product page
Specifications
| Material and structure | Piezoelectric single crystal / silicon, room-temperature direct bonding |
|---|---|
| Key feature | Suppresses thermal expansion and reduces frequency drift of SAW filters |
| Main applications | SAW filters for smartphones and other devices |
Specifications as published by the maker. See the sources below.
Overview
NGK Insulators' bonded wafers for SAW filters are substrates made by bonding a thinned piezoelectric single crystal to silicon. They are used in SAW (surface acoustic wave) filters for smartphones and other devices.
They are bonded directly at room temperature without adhesive. Combining them with low-thermal-expansion silicon suppresses shifts in filter frequency caused by temperature changes.
Key features
- Bonded structure of a piezoelectric single crystal and silicon
- Room-temperature direct bonding without adhesive
- Less frequency drift with temperature
Applications
- SAW filters for smartphones
- RF front-end components
Sources
Last updated: October 23, 2026