Assembly materials
ECO SOLDER M705 (solder balls)
Solder balls of Senju Metal Industry's Sn-Ag-Cu lead-free solder M705.
Maker: Senju Metal Industry · Official product page
Specifications
| Composition | Sn-3.0Ag-0.5Cu |
|---|---|
| Melting point | 217 to 220 °C |
| Main applications | Bump formation for BGAs and CSPs |
Specifications as published by the maker. See the sources below.
Overview
ECO SOLDER M705 is Senju Metal Industry's lead-free solder alloy. Its composition is tin with 3.0% silver and 0.5% copper (Sn-3.0Ag-0.5Cu), and its melting point is 217 to 220 °C.
It is supplied in forms such as solder balls and solder paste. Solder balls are used for the external terminals (bumps) of BGA and CSP packages.
Key features
- Sn-3.0Ag-0.5Cu composition
- Melting point of 217 to 220 °C
- Several forms, including balls and paste
Applications
- Bump formation for BGAs and CSPs
- Board assembly
Also listed under: Solder materials
Sources
Last updated: October 23, 2026