WTS-377
A wafer and final test system for digital-output CMOS image sensors. It is configured for measuring CIS for digital cameras, mobile phones and automotive use.
Maker: WINTEST
Specifications
| Target devices | Digital-output CMOS image sensors |
|---|---|
| Devices tested in parallel | 16 as standard, up to 32 |
| High-speed digital I/O pins | 200 MHz, 1024 pins as standard |
| Pixel data capture | Parallel 200 MHz, 32 ch as standard (16 bit/ch); supports high-speed serial such as MIPI and HiSPI |
| Source meters for power pins | -2V to +12.5V / 800mA, 64 ch standard; 200mA, 64 ch standard |
| Main applications | Wafer test and final test of volume CIS |
Specifications as published by the maker. See the sources below.
Overview
WTS-377 is WINTEST's test system for digital-output CMOS image sensors. It targets digital-output CMOS image sensors with the latest architectures, combining low cost with high performance. It was developed and launched in December 2010 as a compact automated test system for CMOS image sensors that can test several devices at once.
Parallel testing covers 16 devices as standard (up to 32), and digital I/O runs at 200 MHz with up to 1,024 pins. Device power supplies cover -2 V to 12.5 V, supplying 800 mA on 64 ch and 200 mA on 64 ch.
Image data capture supports parallel 200 MHz on 32 ch (16 bit/ch, 384M pixels/ch) and 1 Gbps serial MIPI and proprietary LVDS with 4 data lanes + 1 clock lane per device. It also has image processing with MIP (multi-image processing system). It is used to test CMOS image sensors for digital still cameras, mobile phones and automotive use.
Key features
- Parallel testing of 16 devices as standard (up to 32)
- 200 MHz digital I/O, up to 1,024 pins
- Image capture by parallel 200 MHz and 1 Gbps MIPI/LVDS
- Image processing with MIP
Applications
- Testing CMOS image sensors for mobile phones, digital cameras and automotive use
Other cmos image sensor manufacturing equipment
- Synapse™ Si · Tokyo Electron (TEL)
More from WINTEST
- BI-M series monitor burn-in systems · Burn-in systems
Sources
Equipment by device type: more products
Last updated: October 23, 2026