BI-M series monitor burn-in systems
Monitor burn-in systems that support multiple power supplies and burn in the latest fine-process devices while running them at maximum operating speed.
Maker: WINTEST · Official product page
Specifications
| Type | Monitor burn-in |
|---|---|
| Target devices | Logic ICs, analog ICs, high-voltage power device ICs |
| Related models | BI-D (dynamic) / BI-T (test burn-in) / QAT (low temperature down to −55 °C) |
| Main applications | Screening early failures, reliability evaluation |
Specifications as published by the maker. See the sources below.
Overview
The BI-M series are WINTEST's monitor burn-in systems. They apply temperature, voltage and current stress to devices to accelerate aging and screen out early failures. Because they use the monitor method, device operation can be watched during burn-in.
They are designed for a variety of logic ICs, analog ICs and high-voltage power device ICs. They support multiple power supplies and can be used for devices made with the latest fine processes. Versions for low voltage and high current at maximum operating speed are also available.
They have a track record of providing a burn-in environment at up to 1.6 Gbps (125 °C) for DDR3. Customization for specific uses is also supported.
Key features
- Burn-in by the monitor method
- Multiple power supplies, low-voltage high-current versions
- Track record of up to 1.6 Gbps (125 °C) for DDR3
Applications
- Burn-in of logic and analog ICs
- Screening of high-voltage power device ICs
Other burn-in systems
- B6700 series · Advantest
- RBC series burn-in chambers · ESPEC
More from WINTEST
- WTS-377 · CMOS image sensor manufacturing equipment
Sources
Burn-in systems
Last updated: October 23, 2026