CMOS image sensor manufacturing equipment

Synapse™ Si

Name: Synapse Si
Brand: Tokyo Electron (TEL)

A wafer bonding system for 300 mm wafers used to make bonded devices. It supports both fusion bonding and Cu hybrid bonding. Bonding the pixel wafer to the logic wafer in a stacked CMOS image sensor is a hybrid bonding step of this kind.

Maker: Tokyo Electron (TEL)

Specifications

Equipment type	Wafer bonder
Wafer size	300 mm
Bonding method	Fusion bonding / Cu hybrid bonding
Key feature	High alignment accuracy together with high throughput
Main applications	Wafer bonding for 3D stacked devices

Specifications as published by the maker. See the sources below.

Overview

Synapse Si is Tokyo Electron's permanent wafer bonding system for 300 mm wafers. It supports both fusion bonding and Cu hybrid bonding.

In advanced CMOS image sensors, next-generation memory and advanced logic, performance is being raised not only by scaling but also by high-density 3D integration using permanent bonding. Synapse Si is designed for this permanent wafer bonding step.

It inherits the platform, cleaning module and plasma treatment module designs proven in front-end equipment, giving high reliability in volume production while combining high alignment accuracy with high throughput. The series also includes Synapse V for temporary bonding of wafers in the TSV process and Synapse Z Plus for debonding and cleaning.

Key features

Supports both fusion and Cu hybrid bonding
Platform, cleaning and plasma treatment proven in front-end equipment
High alignment accuracy and high throughput

Applications

Wafer stacking for backside-illuminated CMOS image sensors
3D integration of next-generation memory and advanced logic

Other cmos image sensor manufacturing equipment

WTS-377 · WINTEST

Sources

Tokyo Electron: Synapse / Ulucus series product page