Dicing and backgrinding tapes
ICROS Tape (backgrinding surface protection tape)
Mitsui Chemicals' wafer surface protection tape. It protects the circuits on the wafer surface during backside grinding (backgrinding).
Maker: Mitsui Chemicals · Official product page
Specifications
| Adhesive type | UV-curable and non-UV |
|---|---|
| Related products | Thermal-release double-sided tape |
| Main applications | Protecting the wafer surface during backside grinding |
Specifications as published by the maker. See the sources below.
Overview
ICROS Tape is Mitsui Chemicals' wafer surface protection tape. In the backgrinding step, which thins the wafer by grinding its back side, it protects the circuits formed on the front from scratches and contamination.
There are UV-curable types, whose adhesion is lowered by UV irradiation, and non-UV types. A double-sided tape that releases when heated is also available.
Key features
- Surface protection tape for backgrinding
- UV-curable and non-UV types
- Thermal-release double-sided tape also available
Applications
- Protecting the wafer surface during backside grinding
- Wafer thinning processes
Other dicing and backgrinding tapes
- Adwill (dicing tapes and BG tapes) · LINTEC
- ELEP HOLDER (dicing tapes) · Nitto Denko
Sources
Dicing and backgrinding tapes
Last updated: October 23, 2026