Dicing and backgrinding tapes
ELEP HOLDER (dicing tapes)
Nitto Denko's dicing tapes. The range centers on UV-release types, whose adhesion is lowered by UV irradiation so chips can be picked up.
Maker: Nitto Denko · Official product page
Specifications
| Adhesive type | UV-release and others |
|---|---|
| Main applications | Holding wafers and chips during dicing |
Specifications as published by the maker. See the sources below.
Overview
ELEP HOLDER is Nitto Denko's line of dicing tapes. In the dicing step, which cuts the wafer into individual chips, they hold the wafer and chips in place.
The range centers on UV-release types, whose adhesion is lowered by UV irradiation: they hold chips firmly during cutting, and after UV exposure the chips can be picked up with little force.
Key features
- UV-release dicing tapes
- Firm holding during cutting and easy pickup
Applications
- Holding wafers and chips during dicing
- Pickup step
Other dicing and backgrinding tapes
- Adwill (dicing tapes and BG tapes) · LINTEC
- ICROS Tape (backgrinding surface protection tape) · Mitsui Chemicals
Sources
Dicing and backgrinding tapes
Last updated: October 23, 2026