Dicing and backgrinding tapes
Dicing tapes hold the wafer and chips in place during dicing and release them for pickup, often after UV irradiation lowers their adhesion. Backgrinding tapes protect the circuit side of the wafer while its back is ground thin.
What it does
Related products include die attach films, which bond chips in stacked packages, and the equipment that applies and removes these tapes.
Products (3)
- Adwill (dicing tapes and BG tapes) · LINTEC
LINTEC's brand of semiconductor and electronic component products. It includes UV-curable and non-UV dicing tapes, backgrinding tapes, die attach films and more.
- ICROS Tape (backgrinding surface protection tape) · Mitsui Chemicals
Mitsui Chemicals' wafer surface protection tape. It protects the circuits on the wafer surface during backside grinding (backgrinding).
- ELEP HOLDER (dicing tapes) · Nitto Denko
Nitto Denko's dicing tapes. The range centers on UV-release types, whose adhesion is lowered by UV irradiation so chips can be picked up.
Japanese makers in this category
- LINTEC · 1 product(s) listed
- Mitsui Chemicals · 1 product(s) listed
- Nitto Denko · 1 product(s) listed
Other materials
Sources
Japanese equipment by category
Dicing and backgrinding tapes
Last updated: October 23, 2026