QFN/QFP lead frames (stamped / etched)
Mitsui High-tec's lead frames, offered both as die-stamped products and as chemically etched products. The company says it was the first in the world to succeed in making lead frames by stamping.
Maker: Mitsui High-tec · Official product page
Specifications
| Processing method | Stamping (for volume production) / etching (high mix, low volume) |
|---|---|
| Supported packages | QFP, QFN, power semiconductors |
| Key feature | First in the world to mass-produce high-pin-count QFPs (100 to 240 pins) |
| Main applications | Packages for ICs, LSIs and power semiconductors |
Specifications as published by the maker. See the sources below.
Overview
Mitsui High-tec's lead frames are metal frames that carry semiconductor chips and connect them electrically to the outside. The company offers both stamped products, punched out with dies, and etched products, shaped by dissolving metal with chemicals.
It is the maker that first succeeded in manufacturing lead frames by stamping. It was also the first in the world to mass-produce high-pin-count QFPs with 100 to 240 pins.
It supplies lead frames for packages such as QFN and QFP and for power semiconductors.
Key features
- Stamped products (for volume production) and etched products (high mix, low volume)
- World's first manufacturing by stamping
- World's first mass production of high-pin-count QFPs
Applications
- Packages for ICs and LSIs
- Power semiconductors
Other lead frames
- QFN lead frames · Dai Nippon Printing (DNP)
- QFN/QFP and TSOP lead frames · Shinko Electric Industries
Sources
Last updated: October 23, 2026