Lead frames
QFN/QFP and TSOP lead frames
Shinko Electric's lead frames made by stamping with ultra-precise dies and by etching. Shinko pioneered volume production of ultra-fine-pitch products.
Specifications
| Processing method | Stamping / etching |
|---|---|
| Supported packages | Leadless (QFN), leaded (QFP/TSOP), exposed pad, crimped, solderless |
| Key feature | Supports ultra-fine pitch |
| Main applications | Smartphones, PCs, automotive, home appliances |
Specifications as published by the maker. See the sources below.
Overview
Shinko Electric's lead frames are made by stamping with ultra-precise dies and by etching. Shinko pioneered volume production of ultra-fine-pitch lead frames.
The range includes leadless QFN (wire bonding, flip chip, dual row), leaded QFP and TSOP, exposed pad products, crimped products and solderless products. QFN can cut the mounting area by about 40% compared with SSOP.
Key features
- Both stamping and etching
- A wide range including QFN, QFP, TSOP and crimped products
- QFN cuts mounting area by about 40% compared with SSOP
Applications
- Smartphones and PCs
- Automotive and home appliances
Other lead frames
- QFN lead frames · Dai Nippon Printing (DNP)
- QFN/QFP lead frames (stamped / etched) · Mitsui High-tec
More from Shinko Electric Industries
- DLL® / DLL3® (flip-chip package substrates) · Package substrates (FC-BGA)
- i-THOP® (substrate for 2.3D packages) · Interposer assembly equipment
Sources
Last updated: October 23, 2026