Lead frames
A lead frame is a thin metal frame, usually copper alloy, that holds the chip and provides the leads that connect it to the circuit board. Lead frames are made by stamping with dies for high volumes or by chemical etching for fine patterns and small lots.
What it does
They are used in QFP, QFN, SOP and many power semiconductor packages, where plating and surface roughening affect wire bonding and adhesion to the mold compound.
Products (3)
- QFN lead frames · Dai Nippon Printing (DNP)
DNP's lead frames for QFN packages, with silver plating areas formed to ±25 µm and roughened copper surfaces for better adhesion to the mold compound.
- QFN/QFP lead frames (stamped / etched) · Mitsui High-tec
Mitsui High-tec's lead frames, offered both as die-stamped products and as chemically etched products. The company says it was the first in the world to succeed in making lead frames by stamping.
- QFN/QFP and TSOP lead frames · Shinko Electric Industries
Shinko Electric's lead frames made by stamping with ultra-precise dies and by etching. Shinko pioneered volume production of ultra-fine-pitch products.
Japanese makers in this category
- Dai Nippon Printing (DNP) · 1 product(s) listed
- Mitsui High-tec · 1 product(s) listed
- Shinko Electric Industries · 1 product(s) listed
Other materials
Sources
Japanese equipment by category
Last updated: October 23, 2026