Lead frames
QFN lead frames
DNP's lead frames for QFN packages, with silver plating areas formed to ±25 µm and roughened copper surfaces for better adhesion to the mold compound.
Specifications
| Processing method | Etching |
|---|---|
| Supported packages | QFN |
| Key feature | Silver plating position accuracy ±25 µm, high-level copper surface roughening |
| Main applications | High-reliability QFN packages for automotive and other uses |
Specifications as published by the maker. See the sources below.
Overview
DNP's QFN lead frames are etched lead frames for QFN packages. DNP announced them as a high-reliability product in October 2021.
Silver plating areas are formed with ±25 µm accuracy. DNP's own patented technology roughens the copper surface to improve adhesion to the mold resin. They meet MSL1, an indicator of reliability against moisture absorption.
Key features
- Silver plating position accuracy of ±25 µm
- Patented roughening technology improves adhesion to mold resin
- Meets MSL1
Applications
- High-reliability QFN packages for automotive and other uses
Other lead frames
- QFN/QFP lead frames (stamped / etched) · Mitsui High-tec
- QFN/QFP and TSOP lead frames · Shinko Electric Industries
More from Dai Nippon Printing (DNP)
- EUV photomasks (2 nm generation and beyond) · Photomasks
Sources
Last updated: October 23, 2026