Double-side polishers (DSP)
DSM series
SpeedFam's double-sided lapping and polishing machines. Besides silicon wafers, they are used for magnetic disk substrates, quartz and ceramic substrates.
Maker: SpeedFam · Official product page
Specifications
| Processing method | Double-sided lapping / polishing |
|---|---|
| Supported workpieces | Silicon wafers (supports 300 mm), SiC, quartz, ceramics |
| Series | 9B, 10.5B-5L/P-V / 14B-7L/P-V, 16B-5L/P-V / DSM30B-5L/P-V |
| Main applications | Double-sided planarization of wafers |
Specifications as published by the maker. See the sources below.
Overview
The DSM series are SpeedFam's double-sided lapping and polishing machines. They flatten wafers by removing material from the front and back at the same time.
Besides silicon wafers (supporting 300 mm), they are used for SiC, quartz, ceramic substrates and magnetic disk substrates. Models include 9B, 10.5B-5L/P-V, 14B-7L/P-V, 16B-5L/P-V and DSM30B-5L/P-V.
Key features
- Double-sided lapping / polishing
- Supports 300 mm silicon wafers
- Also handles SiC, quartz and ceramics
Applications
- Double-sided planarization of wafers
More from SpeedFam
- EP-300-X · Wafer edge polishers
Sources
Wafer manufacturing equipment: more products
Last updated: October 23, 2026