EP-300-X
SpeedFam's edge polisher for 12-inch wafers that polishes the upper bevel, lower bevel and edge face individually at high speed. SpeedFam has shipped about 600 units since 1988.
Maker: SpeedFam · Official product page
Specifications
| Polishing method | Pad polishing (each area polished separately) |
|---|---|
| Wafer size | 300 mm (EP-200-XW-II for 200 mm) |
| Related models | EP-300-XW / EP450W (450 mm) |
| Main applications | Mirror finishing of silicon wafer edges |
Specifications as published by the maker. See the sources below.
Overview
EP-300-X is SpeedFam's edge polisher for 300 mm bare silicon wafers. It polishes the outer edge of the wafer to a mirror finish, removing the damaged area across the whole edge.
In addition to the outer edge, it mirror-polishes the inside of the notch and the straight section of the orientation flat by polishing these surfaces simultaneously. It is positioned as a high-throughput tool.
Edge damage and chipping cause particles and wafer breakage in later processes and affect chip yield. SpeedFam has shipped about 600 edge polishers for silicon wafers since 1988 and has a lineup from 450 mm down to small diameters.
Key features
- Simultaneous polishing mirror-finishes the edge, notch and OF
- Removes the damaged area across the whole edge
- High throughput
- About 600 units shipped since 1988
Applications
- Edge polishing of 300 mm silicon wafers
More from SpeedFam
- DSM series · Double-side polishers (DSP)
Sources
Wafer manufacturing equipment: more products
Last updated: October 23, 2026